Findchips: Parametric Search Results for AM29BDS320GBD9VMI


Select Parts		Part Number

		AM29BDS320GBD9VMI AMD
		AM29BDS320GBD9VMI Cypress Semiconductor
		AM29BDS320GBD9VMI Spansion

			Most Relevant							Technical																						Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

33.5544 Mbit

8K,32K

2MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST ACCESS ALSO POSSIBLE

BOTTOM

YES

8,62

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

10 µA

60 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA64,8X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1 mm

8.95 mm

7.95 mm

ADVANCED MICRO DEVICES INC

BGA

VFBGA, BGA64,8X8,32

unknown

EAR99

8542.32.00.51

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Active

33.5544 Mbit

8K,32K

2MX16

1.8 V

70 ns

FLASH

BOTTOM

YES

8,62

2000000

2.0972 M

PARALLEL

YES

10 µA

60 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST ACCESS ALSO POSSIBLE

BOTTOM

YES

8,62

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

10 µA

60 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,8X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.95 mm

7.95 mm

SPANSION INC

BGA

8 X 9 MM, 0.80 MM PITCH, FBGA-64

not_compliant

EAR99

8542.32.00.51

Compare

AM29BDS320GBD9VMI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,32K

2MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST ACCESS ALSO POSSIBLE

BOTTOM

YES

8,62

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

10 µA

60 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA64,8X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1 mm

8.95 mm

7.95 mm

ADVANCED MICRO DEVICES INC

BGA

VFBGA, BGA64,8X8,32

unknown

EAR99

8542.32.00.51

AM29BDS320GBD9VMI

Cypress Semiconductor

Check for Price

Active

33.5544 Mbit

8K,32K

2MX16

1.8 V

70 ns

FLASH

BOTTOM

YES

8,62

2000000

2.0972 M

PARALLEL

YES

10 µA

60 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

AM29BDS320GBD9VMI

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST ACCESS ALSO POSSIBLE

BOTTOM

YES

8,62

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

10 µA

60 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,8X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.95 mm

7.95 mm

SPANSION INC

BGA

8 X 9 MM, 0.80 MM PITCH, FBGA-64

not_compliant

EAR99

8542.32.00.51

Parametric results for: AM29BDS320GBD9VMI under Flash Memories