Findchips: Parametric Search Results for AM27S32

Parametric results for: AM27S32 under OTP ROMs

Select parts from the table below to compare.

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Select Parts		Part Number

		AM27S32APCB AMD
		AM27S32DCTB AMD
		AM27S32/BYA AMD
		AM27S32PC AMD
		AM27S32ALM AMD
		AM27S32AFCB AMD
		AM27S32DM AMD
		AM27S32/BVA AMD
		AM27S32FCB AMD
		AM27S32FC AMD

				Most Relevant					Technical											Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

8.3886 Mbit

1MX8

5 V

250 ns

OTP ROM

1000000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

COMMERCIAL EXTENDED

R-PDIP-T18

Not Qualified

75 °C

PLASTIC/EPOXY

DIP

DIP18,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

22.987 mm

7.62 mm

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

25 ns

OTP ROM

32000

1.024 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

TTL

COMMERCIAL

R-XDIP-T18

70 °C

CERAMIC

DIP

DIP18,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

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Obsolete

256 bit

32X8

5 V

35 ns

OTP ROM

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

MILITARY

R-CDFP-F18

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

DFP

FL18,.3

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.779 mm

9.525 mm

ADVANCED MICRO DEVICES INC

DFP

DFP, FL18,.3

unknown

EAR99

8542.32.00.71

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Obsolete

131.072 kbit

16KX8

5 V

120 ns

OTP ROM

16000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.5 V

4.5 V

BIPOLAR

COMMERCIAL EXTENDED

R-PDIP-T18

Not Qualified

75 °C

PLASTIC/EPOXY

DIP

DIP18,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

22.987 mm

7.62 mm

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

32.768 kbit

4KX8

5 V

25 ns

OTP ROM

4000

1.024 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

TTL

MILITARY

S-XQCC-N20

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC

QCCN

LCC20,.35SQ

SQUARE

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

ADVANCED MICRO DEVICES INC

QCCN, LCC20,.35SQ

unknown

EAR99

8542.32.00.71

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Obsolete

1.0486 Mbit

128KX8

5 V

25 ns

OTP ROM

128000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.5 V

4.5 V

BIPOLAR

COMMERCIAL EXTENDED

R-CDFP-F18

Not Qualified

75 °C

CERAMIC, METAL-SEALED COFIRED

DFP

FL18,.3

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.779 mm

9.525 mm

ADVANCED MICRO DEVICES INC

DFP

DFP, FL18,.3

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

32.768 kbit

4KX8

5 V

65 ns

OTP ROM

4000

1.024 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

TTL

MILITARY

R-XDIP-T18

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC

DIP

DIP18,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

256 bit

32X8

5 V

50 ns

OTP ROM

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

MILITARY

R-GDIP-T18

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP18,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

22.86 mm

7.62 mm

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

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Obsolete

8.3886 Mbit

1MX8

5 V

250 ns

OTP ROM

1000000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

COMMERCIAL EXTENDED

R-CDFP-F18

Not Qualified

75 °C

CERAMIC, METAL-SEALED COFIRED

DFP

FL18,.3

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.779 mm

9.525 mm

ADVANCED MICRO DEVICES INC

DFP

DFP, FL18,.3

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

4MX8

5 V

250 ns

OTP ROM

4000000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

COMMERCIAL EXTENDED

R-CDFP-F18

Not Qualified

75 °C

CERAMIC, METAL-SEALED COFIRED

DFP

FL18,.3

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.779 mm

9.525 mm

ADVANCED MICRO DEVICES INC

DFP

DFP, FL18,.3

unknown

EAR99

8542.32.00.71

1 2 3 4 Next

Compare

AM27S32APCB

AMD

Check for Price

Obsolete

8.3886 Mbit

1MX8

5 V

250 ns

OTP ROM

1000000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

COMMERCIAL EXTENDED

R-PDIP-T18

Not Qualified

75 °C

PLASTIC/EPOXY

DIP

DIP18,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

22.987 mm

7.62 mm

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

AM27S32DCTB

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

25 ns

OTP ROM

32000

1.024 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

TTL

COMMERCIAL

R-XDIP-T18

70 °C

CERAMIC

DIP

DIP18,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

AM27S32/BYA

AMD

Check for Price

Obsolete

256 bit

32X8

5 V

35 ns

OTP ROM

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

MILITARY

R-CDFP-F18

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

DFP

FL18,.3

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.779 mm

9.525 mm

ADVANCED MICRO DEVICES INC

DFP

DFP, FL18,.3

unknown

EAR99

8542.32.00.71

AM27S32PC

AMD

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

120 ns

OTP ROM

16000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.5 V

4.5 V

BIPOLAR

COMMERCIAL EXTENDED

R-PDIP-T18

Not Qualified

75 °C

PLASTIC/EPOXY

DIP

DIP18,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

22.987 mm

7.62 mm

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

AM27S32ALM

AMD

Check for Price

Obsolete

32.768 kbit

4KX8

5 V

25 ns

OTP ROM

4000

1.024 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

TTL

MILITARY

S-XQCC-N20

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC

QCCN

LCC20,.35SQ

SQUARE

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

ADVANCED MICRO DEVICES INC

QCCN, LCC20,.35SQ

unknown

EAR99

8542.32.00.71

AM27S32AFCB

AMD

Check for Price

Obsolete

1.0486 Mbit

128KX8

5 V

25 ns

OTP ROM

128000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.5 V

4.5 V

BIPOLAR

COMMERCIAL EXTENDED

R-CDFP-F18

Not Qualified

75 °C

CERAMIC, METAL-SEALED COFIRED

DFP

FL18,.3

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.779 mm

9.525 mm

ADVANCED MICRO DEVICES INC

DFP

DFP, FL18,.3

unknown

EAR99

8542.32.00.71

AM27S32DM

AMD

Check for Price

Obsolete

32.768 kbit

4KX8

5 V

65 ns

OTP ROM

4000

1.024 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

TTL

MILITARY

R-XDIP-T18

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC

DIP

DIP18,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

AM27S32/BVA

AMD

Check for Price

Obsolete

256 bit

32X8

5 V

50 ns

OTP ROM

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

MILITARY

R-GDIP-T18

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP18,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

22.86 mm

7.62 mm

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP18,.3

unknown

EAR99

8542.32.00.71

AM27S32FCB

AMD

Check for Price

Obsolete

8.3886 Mbit

1MX8

5 V

250 ns

OTP ROM

1000000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

COMMERCIAL EXTENDED

R-CDFP-F18

Not Qualified

75 °C

CERAMIC, METAL-SEALED COFIRED

DFP

FL18,.3

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.779 mm

9.525 mm

ADVANCED MICRO DEVICES INC

DFP

DFP, FL18,.3

unknown

EAR99

8542.32.00.71

AM27S32FC

AMD

Check for Price

Obsolete

33.5544 Mbit

4MX8

5 V

250 ns

OTP ROM

4000000

1.024 k

ASYNCHRONOUS

OPEN-COLLECTOR

PARALLEL

5.25 V

4.75 V

BIPOLAR

COMMERCIAL EXTENDED

R-CDFP-F18

Not Qualified

75 °C

CERAMIC, METAL-SEALED COFIRED

DFP

FL18,.3

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.779 mm

9.525 mm

ADVANCED MICRO DEVICES INC

DFP

DFP, FL18,.3

unknown

EAR99

8542.32.00.71

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