Findchips: Parametric Search Results for AM27H25635V05


Select Parts		Part Number

		AM27H256-35V05DIB AMD
		AM27H256-35V05LC AMD
		AM27H256-35V05LI AMD
		AM27H256-35V05DC AMD
		AM27H256-35V05DI AMD
		AM27H256-35V05DCB AMD
		AM27H256-35V05LIB AMD
		AM27H256-35V05LCB AMD

			Most Relevant					Technical															Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

60 µA

5.25 V

4.75 V

CMOS

INDUSTRIAL

R-GDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

25 mA

50 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

60 µA

5.25 V

4.75 V

CMOS

INDUSTRIAL

R-CQCC-N32

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

25 mA

50 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

60 µA

5.25 V

4.75 V

CMOS

INDUSTRIAL

R-GDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

25 mA

50 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

60 µA

5.25 V

4.75 V

CMOS

INDUSTRIAL

R-CQCC-N32

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

25 mA

50 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

Compare

AM27H256-35V05DIB

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

60 µA

5.25 V

4.75 V

CMOS

INDUSTRIAL

R-GDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

AM27H256-35V05LC

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

25 mA

50 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

AM27H256-35V05LI

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

60 µA

5.25 V

4.75 V

CMOS

INDUSTRIAL

R-CQCC-N32

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

AM27H256-35V05DC

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

25 mA

50 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

AM27H256-35V05DI

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

60 µA

5.25 V

4.75 V

CMOS

INDUSTRIAL

R-GDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

AM27H256-35V05DCB

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

25 mA

50 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

AM27H256-35V05LIB

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

60 µA

5.25 V

4.75 V

CMOS

INDUSTRIAL

R-CQCC-N32

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

AM27H256-35V05LCB

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

35 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

25 mA

50 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

Parametric results for: AM27H25635V05 under EPROMs