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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: ALXC800EETJCVD%20C3 under Microprocessors

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	Part Number

Microcontrollers and Processors

AMD

				Most Relevant						Technical										Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Yes

Yes

Obsolete

32

500 MHz

32

32

YES

1.2 V

MICROPROCESSOR

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

YES

1.24 V

1.16 V

OTHER

S-PBGA-B481

Not Qualified

e2

3

85 °C

481

PLASTIC/EPOXY

HBGA

BGA481,31X31,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER

BALL

1.27 mm

BOTTOM

2.59 mm

40 mm

40 mm

ADVANCED MICRO DEVICES INC

BGA

HBGA, BGA481,31X31,50

481

compliant

8473.30.11.80

Compare

Microcontrollers and Processors

AMD

Check for Price

Yes

Yes

Obsolete

32

500 MHz

32

32

YES

1.2 V

MICROPROCESSOR

CMOS

ALSO REQUIRES 3.3V SUPPLY

YES

FLOATING POINT

YES

YES

1.24 V

1.16 V

OTHER

S-PBGA-B481

Not Qualified

e2

3

85 °C

481

PLASTIC/EPOXY

HBGA

BGA481,31X31,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER

BALL

1.27 mm

BOTTOM

2.59 mm

40 mm

40 mm

ADVANCED MICRO DEVICES INC

BGA

HBGA, BGA481,31X31,50

481

compliant

8473.30.11.80