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93AA76C-I/P
Microchip Technology Inc
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$0.0476 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 1 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.27 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||
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93AA76C-I/SN
Microchip Technology Inc
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$0.4865 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 1 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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93AA76CT-I/MNY
Microchip Technology Inc
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$0.5050 | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 3 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | 2.5 V | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e4 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||
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93AA76C-I/MS
Microchip Technology Inc
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$0.5050 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 1 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | MSOP | ROHS COMPLIANT, PLASTIC, MSOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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93AA76CT-I/SN
Microchip Technology Inc
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$0.5330 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 3 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.91 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | 8 | compliant | ||||||
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93AA76CT-I/ST
Microchip Technology Inc
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$0.5965 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 3 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8 | 8 | compliant | ||||||
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93AA76CT-I/MS
Microchip Technology Inc
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$0.5965 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 3 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | MSOP | LEAD FREE, PLASTIC, MO-187, MSOP-8 | 8 | compliant | ||||||
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93AA76C-I/ST
Microchip Technology Inc
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$0.5965 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 1 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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93AA76CT-I/MC
Microchip Technology Inc
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$0.6109 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 3 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | DUAL | 1 mm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229VCED-2, DFN-8 | 8 | compliant | Microchip | |||||
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93AA76C-TI/ST
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 3 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | TSSOP | TSSOP, TSSOP8,.25 | 8 | compliant | EAR99 | 8542.32.00.51 |