Parametric results for: 93AA76C under EEPROMs

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Manufacturer Part Number: 93aa76c
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93AA76C-I/P
Microchip Technology Inc
$0.0476 Yes Yes Active 8.192 kbit 16 512X16 2.5 V 1 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE R-PDIP-T8 Not Qualified e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.27 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 8 compliant EAR99 8542.32.00.51 Microchip
93AA76C-I/SN
Microchip Technology Inc
$0.4865 Yes Yes Active 8.192 kbit 16 512X16 2.5 V 1 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 8 compliant EAR99 8542.32.00.51 Microchip
93AA76CT-I/MNY
Microchip Technology Inc
$0.5050 Yes Active 8.192 kbit 16 512X16 2.5 V 3 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS SERIAL 2.5 V MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL 5 ms HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified e4 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY HVSON SOLCC8,.11,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 800 µm 3 mm 2 mm MICROCHIP TECHNOLOGY INC compliant EAR99 8542.32.00.51
93AA76C-I/MS
Microchip Technology Inc
$0.5050 Yes Yes Active 8.192 kbit 16 512X16 2.5 V 1 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE S-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 3 mm 3 mm MICROCHIP TECHNOLOGY INC MSOP ROHS COMPLIANT, PLASTIC, MSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
93AA76CT-I/SN
Microchip Technology Inc
$0.5330 Yes Yes Active 8.192 kbit 16 512X16 2.5 V 3 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.91 mm MICROCHIP TECHNOLOGY INC SOIC 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 8 compliant
93AA76CT-I/ST
Microchip Technology Inc
$0.5965 Yes Yes Active 8.192 kbit 16 512X16 2.5 V 3 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8 8 compliant
93AA76CT-I/MS
Microchip Technology Inc
$0.5965 Yes Yes Active 8.192 kbit 16 512X16 2.5 V 3 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE S-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 3 mm 3 mm MICROCHIP TECHNOLOGY INC MSOP LEAD FREE, PLASTIC, MO-187, MSOP-8 8 compliant
93AA76C-I/ST
Microchip Technology Inc
$0.5965 Yes Yes Active 8.192 kbit 16 512X16 2.5 V 1 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
93AA76CT-I/MC
Microchip Technology Inc
$0.6109 Yes Yes Active 8.192 kbit 16 512X16 2.5 V 3 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE R-PDSO-N8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY HVSON SOLCC8,.11,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm DUAL 1 mm 3 mm 2 mm MICROCHIP TECHNOLOGY INC DFN 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229VCED-2, DFN-8 8 compliant Microchip
93AA76C-TI/ST
Microchip Technology Inc
Check for Price Yes Yes Active 8.192 kbit 16 512X16 2.5 V 3 MHz EEPROM 8 200 1000000 Write/Erase Cycles 1 1 512 512 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 5 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC TSSOP TSSOP, TSSOP8,.25 8 compliant EAR99 8542.32.00.51