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Manufacturer Part Number: 89ttm553bl

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	Part Number

89TTM553BL

Integrated Device Technology Inc

			Most Relevant			Technical				Compliance			Operating Conditions	Physical								Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

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Obsolete

YES

1.8 V

MICROPROCESSOR CIRCUIT

CMOS

1.89 V

1.71 V

OTHER

S-PBGA-B960

Not Qualified

85 °C

960

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

BOTTOM

3.29 mm

35 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

35 X 35 MM, 1 MM PITCH, FPBGA-960

960

not_compliant

8542.31.00.01