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Parametric » Memory » OTP ROMs

Parametric results for: 82hs321abka under OTP ROMs

Select parts from the table below to compare.

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Select Parts		Part Number

		82HS321A/BKA Philips Semiconductors
		82HS321A/BKA NXP Semiconductors
		82HS321A/BKA YAGEO Corporation

			Most Relevant					Technical											Compliance			Operating Conditions			Physical											Dimensions		Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Category CO2 Kg	Compliance Temperature Grade	Part Package Code	Pin Count	Environmental Documents

Check for Price

No

Transferred

32.768 kbit

8

4KX8

5 V

45 ns

OTP ROM

4000

4.096 k

TTL

MILITARY

R-XDFP-F24

Not Qualified

e0

125 °C

-55 °C

38535Q/M;38534H;883B

24

CERAMIC

DFP

FL24,.4

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

FLAT

1.27 mm

DUAL

PHILIPS SEMICONDUCTORS

DFP, FL24,.4

unknown

EAR99

8542.32.00.71

12

Military: -55C to +125C

Check for Price

Obsolete

32.768 kbit

8

4KX8

5 V

30 ns

OTP ROM

1

4000

4.096 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-CDFP-F24

Not Qualified

125 °C

-55 °C

24

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

2.286 mm

9.144 mm

NXP SEMICONDUCTORS

DFP,

unknown

EAR99

8542.32.00.71

12

Military: -55C to +125C

DFP

24

[object Object],[object Object]

Check for Price

Obsolete

32.768 kbit

8

4KX8

5 V

45 ns

OTP ROM

1

4000

4.096 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-CDFP-F24

Not Qualified

125 °C

-55 °C

24

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

DUAL

PHILIPS COMPONENTS

,

unknown

EAR99

8542.32.00.71

12

Military: -55C to +125C

Compare

Philips Semiconductors

Check for Price

No

Transferred

32.768 kbit

8

4KX8

5 V

45 ns

OTP ROM

4000

4.096 k

TTL

MILITARY

R-XDFP-F24

Not Qualified

e0

125 °C

-55 °C

38535Q/M;38534H;883B

24

CERAMIC

DFP

FL24,.4

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

FLAT

1.27 mm

DUAL

PHILIPS SEMICONDUCTORS

DFP, FL24,.4

unknown

EAR99

8542.32.00.71

12

Military: -55C to +125C

NXP Semiconductors

Check for Price

Obsolete

32.768 kbit

8

4KX8

5 V

30 ns

OTP ROM

1

4000

4.096 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-CDFP-F24

Not Qualified

125 °C

-55 °C

24

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

2.286 mm

9.144 mm

NXP SEMICONDUCTORS

DFP,

unknown

EAR99

8542.32.00.71

12

Military: -55C to +125C

DFP

24

[object Object],[object Object]

YAGEO Corporation

Check for Price

Obsolete

32.768 kbit

8

4KX8

5 V

45 ns

OTP ROM

1

4000

4.096 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-CDFP-F24

Not Qualified

125 °C

-55 °C

24

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

DUAL

PHILIPS COMPONENTS

,

unknown

EAR99

8542.32.00.71

12

Military: -55C to +125C