Parametric results for: 82S2708 under OTP ROMs

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Manufacturer Part Number: 82s2708
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82S2708/BLA
Philips Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDIP-T24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC DIP DIP24,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL PHILIPS SEMICONDUCTORS DIP, DIP24,.3 unknown EAR99 8542.32.00.71
S82S2708I/883B
NXP Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDIP-T24 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SIGNETICS CORP DIP, DIP24,.6 unknown EAR99 8542.32.00.71
82S2708/BJA
NXP Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDIP-T24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SIGNETICS CORP DIP, DIP24,.6 unknown EAR99 8542.32.00.71
S82S2708F/883B
NXP Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDIP-T24 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SIGNETICS CORP DIP, DIP24,.6 unknown EAR99 8542.32.00.71
82S2708/BJA
Philips Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDIP-T24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SIGNETICS CORP DIP, DIP24,.6 unknown EAR99 8542.32.00.71
82S2708/BYA
Philips Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDFP-F24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC DFP FL24,.4 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL PHILIPS SEMICONDUCTORS DFP, FL24,.4 unknown EAR99 8542.32.00.71
N82S2708F
Philips Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 70 ns OTP ROM 1000 1.024 k 175 µA TTL COMMERCIAL R-XDIP-T24 Not Qualified e0 70 °C 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL PHILIPS SEMICONDUCTORS DIP-24 unknown EAR99 8542.32.00.71
82S2708/BJA
Signetics
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDIP-T24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC DIP DIP24,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SIGNETICS CORP DIP, DIP24,.6 unknown EAR99 8542.32.00.71
82S2708/BKA
NXP Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDFP-F24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC DFP FL24,.4 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL SIGNETICS CORP DFP, FL24,.4 unknown EAR99 8542.32.00.71
82S2708/BKA
Philips Semiconductors
Check for Price No Obsolete 8.192 kbit 8 1KX8 90 ns OTP ROM 1000 1.024 k 185 µA TTL MILITARY R-XDFP-F24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC DFP FL24,.4 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL SIGNETICS CORP DFP, FL24,.4 unknown EAR99 8542.32.00.71