Findchips: Parametric Search Results for 7m1003

Parametric results for: 7m1003 under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		7M1003S65C Integrated Device Technology Inc
		7M1003S50C Integrated Device Technology Inc
		IDT7M1003S30C Integrated Device Technology Inc
		IDT7M1003S40C Integrated Device Technology Inc
		IDT7M1003S35C Integrated Device Technology Inc
		7M1003S25C Integrated Device Technology Inc
		IDT7M1003S40CB Integrated Device Technology Inc
		IDT7M1003S35CB Integrated Device Technology Inc
		IDT7M1003S50CB Integrated Device Technology Inc
		7M1003S30C Integrated Device Technology Inc

				Most Relevant					Technical																		Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

65 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDMA-T64

Not Qualified

70 °C

260

CERAMIC, METAL-SEALED COFIRED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

9.652 mm

81.28 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

CERAMIC, SIDEBRAZED, DIP-64

SB64

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

50 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDMA-T64

Not Qualified

70 °C

260

CERAMIC, METAL-SEALED COFIRED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

9.652 mm

81.28 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

CERAMIC, SIDEBRAZED, DIP-64

SB64

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

30 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-XDMA-T64

Not Qualified

70 °C

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

40 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-XDMA-T64

Not Qualified

70 °C

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

35 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-XDMA-T64

Not Qualified

70 °C

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

25 ns

MULTI-PORT SRAM MODULE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

65 mA

4.5 V

660 µA

CMOS

COMMERCIAL

R-XDIP-T64

Not Qualified

70 °C

CERAMIC

DIP

DIP64,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

unknown

EAR99

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

40 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

125 mA

4.5 V

790 µA

5.5 V

4.5 V

CMOS

MILITARY

R-XDMA-T64

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B (Modified)

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

35 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

125 mA

4.5 V

790 µA

5.5 V

4.5 V

CMOS

MILITARY

R-XDMA-T64

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B (Modified)

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

50 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

125 mA

4.5 V

790 µA

5.5 V

4.5 V

CMOS

MILITARY

R-XDMA-T64

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B (Modified)

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

30 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDMA-T64

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

9.652 mm

81.28 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP, DIP64,.6

not_compliant

EAR99

8542.32.00.41

1 2 3 Next

Compare

7M1003S65C

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

65 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDMA-T64

Not Qualified

70 °C

260

CERAMIC, METAL-SEALED COFIRED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

9.652 mm

81.28 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

CERAMIC, SIDEBRAZED, DIP-64

SB64

not_compliant

EAR99

8542.32.00.41

7M1003S50C

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

50 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDMA-T64

Not Qualified

70 °C

260

CERAMIC, METAL-SEALED COFIRED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

9.652 mm

81.28 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

CERAMIC, SIDEBRAZED, DIP-64

SB64

not_compliant

EAR99

8542.32.00.41

IDT7M1003S30C

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

30 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-XDMA-T64

Not Qualified

70 °C

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

EAR99

8542.32.00.41

IDT7M1003S40C

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

40 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-XDMA-T64

Not Qualified

70 °C

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

EAR99

8542.32.00.41

IDT7M1003S35C

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

35 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-XDMA-T64

Not Qualified

70 °C

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

EAR99

8542.32.00.41

7M1003S25C

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

25 ns

MULTI-PORT SRAM MODULE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

65 mA

4.5 V

660 µA

CMOS

COMMERCIAL

R-XDIP-T64

Not Qualified

70 °C

CERAMIC

DIP

DIP64,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

unknown

EAR99

8542.32.00.41

IDT7M1003S40CB

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

40 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

125 mA

4.5 V

790 µA

5.5 V

4.5 V

CMOS

MILITARY

R-XDMA-T64

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B (Modified)

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

3A001.A.2.C

8542.32.00.41

IDT7M1003S35CB

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

35 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

125 mA

4.5 V

790 µA

5.5 V

4.5 V

CMOS

MILITARY

R-XDMA-T64

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B (Modified)

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

3A001.A.2.C

8542.32.00.41

IDT7M1003S50CB

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

50 ns

MULTI-PORT SRAM MODULE

SEMAPHORE

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

125 mA

4.5 V

790 µA

5.5 V

4.5 V

CMOS

MILITARY

R-XDMA-T64

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B (Modified)

UNSPECIFIED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

3A001.A.2.C

8542.32.00.41

7M1003S30C

Integrated Device Technology Inc

Check for Price

Obsolete

524.288 kbit

64KX8

5 V

30 ns

MULTI-PORT SRAM

COMMON

64000

65.536 k

ASYNCHRONOUS

3-STATE

PARALLEL

65 mA

4.5 V

660 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDMA-T64

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP64,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

9.652 mm

81.28 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP, DIP64,.6

not_compliant

EAR99

8542.32.00.41

1 2 3 Next