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74HC4852BQ-Q100,11
NXP Semiconductors
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Check for Price | Yes | Transferred | YES | 700 Ω | 50 mA | DIFFERENTIAL MULTIPLEXER | CMOS | 4 | 1 | 20 µA | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | 125 °C | -40 °C | AEC-Q100 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | QFN | 16 | SOT763-1 | compliant | ||||||||||||||||||||
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74HC4852BQ-Q100,11
Nexperia
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Check for Price | Yes | Active | 3 V | YES | 330 Ω | 2 Ω | 57.5 ns | 115 ns | SINGLE-ENDED MULTIPLEXER | CMOS | 4 | 2 | 6 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NEXPERIA | QFN | 16 | SOT763-1 | compliant | DHVQFN-16 | 8542.39.00.01 | Nexperia | ||||||
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74HC4852BQ
NXP Semiconductors
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Check for Price | Yes | Transferred | 3 V | YES | 330 Ω | 8 Ω | 47.5 ns | 50 mA | DIFFERENTIAL MULTIPLEXER | CMOS | 4 | 1 | 20 µA | 6 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NXP SEMICONDUCTORS | QFN | 16 | compliant | 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16 | 8542.39.00.01 | |||||||||
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74HC4852BQ,115
Nexperia
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Check for Price | Yes | Active | 3 V | YES | 330 Ω | 8 Ω | 57.5 ns | 115 ns | DIFFERENTIAL MULTIPLEXER | CMOS | 4 | 1 | 6 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | VQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NEXPERIA | QFN | 16 | SOT763-1 | compliant | DHVQFN-16 | 8542.39.00.01 | Nexperia | 2017-02-01 | ||||||
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74HC4852BQ,115
NXP Semiconductors
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Check for Price | Yes | Transferred | 3 V | YES | 330 Ω | 8 Ω | 47.5 ns | 50 mA | DIFFERENTIAL MULTIPLEXER | CMOS | 4 | 1 | 20 µA | 6 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NXP SEMICONDUCTORS | QFN | 16 | SOT763-1 | compliant | 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16 | 8542.39.00.01 | ||||||
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74HC4852BQ-Q100
NXP Semiconductors
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Check for Price | Yes | Transferred | SINGLE-ENDED MULTIPLEXER | 1 | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | NXP SEMICONDUCTORS | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||||
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74HC4852BQ
Nexperia
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Check for Price | Yes | Active | 3 V | YES | 330 Ω | 8 Ω | 57.5 ns | 115 ns | DIFFERENTIAL MULTIPLEXER | CMOS | 4 | 1 | 6 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | VQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NEXPERIA | compliant | DHVQFN-16 | 8542.39.00.01 | 2017-02-01 | ||||||||||
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74HC4852BQ-G
NXP Semiconductors
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Check for Price | Yes | Obsolete | YES | 700 Ω | 47.5 ns | 50 mA | DIFFERENTIAL MULTIPLEXER | CMOS | 4 | 1 | 20 µA | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | 125 °C | -40 °C | 16 | PLASTIC/EPOXY | QCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | unknown | QCCN, LCC16,.1X.14,20 | 8542.39.00.01 | |||||||||||||||||||||
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74HC4852BQ-Q100
Nexperia
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Check for Price | Yes | Active | e4 | 1 | 260 | AEC-Q100 | 30 | NICKEL PALLADIUM GOLD | NEXPERIA | compliant | 8542.39.00.01 | 2017-02-01 |