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74LVC2G34GW-Q100,1
Nexperia
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$0.1460 | Active | 1.8 V | 10.8 ns | 2 | 1 | YES | TSSOP | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR, 7 INCH | TIN | GULL WING | 650 µm | DUAL | 1.1 mm | 1.25 mm | 2 mm | NEXPERIA | TSSOP | TSSOP, | 6 | SOT363-2 | compliant | Nexperia | |||||||||||
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74LVC2G34GW-Q100/CU
Nexperia
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Check for Price | Yes | Active | 1.8 V | 10.8 ns | 2 | 1 | YES | TSSOP | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN | GULL WING | 650 µm | DUAL | 1.1 mm | 1.25 mm | 2 mm | NEXPERIA | TSSOP, | compliant | 8542.39.00.01 | ||||||||||||||
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74LVC2G34GW-Q100/H
Nexperia
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Check for Price | Yes | Active | 1.8 V | 10.8 ns | 2 | 1 | YES | TSSOP | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN | GULL WING | 650 µm | DUAL | 1.1 mm | 1.25 mm | 2 mm | NEXPERIA | TSSOP | TSSOP, | 6 | SOT363 | compliant | ||||||||||||
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74LVC2G34GW-Q100
NXP Semiconductors
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Check for Price | Yes | Transferred | 3.3 V | 10.8 ns | 2 | 1 | YES | TSSOP | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | e3 | 1 | 125 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 650 µm | DUAL | 1.1 mm | 1.25 mm | 2 mm | NXP SEMICONDUCTORS | SOT-363 | TSSOP, | 6 | unknown | 8542.39.00.01 | ||||||||||||
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74LVC2G34GW-Q100
Nexperia
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Check for Price | Yes | Active | 1.8 V | 10.8 ns | 2 | 1 | YES | TSSOP | 50 pF | YES | LVC/LCX/Z | BUFFER | CMOS | 32 mA | 4 µA | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 6 | PLASTIC/EPOXY | TSSOP6,.08 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN | GULL WING | 650 µm | DUAL | 1.1 mm | 1.25 mm | 2 mm | NEXPERIA | TSSOP, | compliant | 8542.39.00.01 | |||||||||
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74LVC2G34GW-Q100,1
NXP Semiconductors
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Check for Price | Yes | Transferred | 3.3 V | 10.8 ns | 5.1 ns | 2 | 1 | YES | TSSOP | 50 pF | NO | LVC/LCX/Z | BUFFER | CMOS | 24 mA | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | Not Qualified | e3 | 125 °C | -40 °C | AEC-Q100 | 6 | PLASTIC/EPOXY | TSSOP6,.08 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | Tin (Sn) | GULL WING | 650 µm | DUAL | 1.1 mm | 1.25 mm | 2 mm | NXP SEMICONDUCTORS | TSSOP | TSSOP, TSSOP6,.08 | 6 | SOT363 | compliant | NXP |