Findchips: Parametric Search Results for 74LVC2G07GW

Parametric results for: 74LVC2G07GW under Gates

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		74LVC2G07GW,125 Nexperia
		74LVC2G07GW-Q100H Nexperia
		74LVC2G07GW Nexperia
		74LVC2G07GW-Q100,125 Nexperia
		74LVC2G07GW-Q100 NXP Semiconductors
		74LVC2G07GW,125 NXP Semiconductors
		74LVC2G07GW-Q100,125 NXP Semiconductors
		74LVC2G07GW Philips Semiconductors
		74LVC2G07GW-Q100H NXP Semiconductors
		74LVC2G07GW-Q100 Nexperia

			Most Relevant											Technical							Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Inputs	Surface Mount	Package Code	Load Capacitance (CL)	Schmitt Trigger	Output Characteristics	Family	Logic IC Type	Technology	Max I(ol)	Power Supply Current-Max (ICC)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$0.1140

Yes

Active

1.8 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP

PLASTIC, SC-88, SOT-363, 6 PIN

SOT363-2

compliant

EAR99

8542.39.00.01

Nexperia

$0.2185

Yes

Active

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP

PLASTIC, SC-88, SOT-363, 6 PIN

SOT363-2

compliant

EAR99

8542.39.00.01

Nexperia

Check for Price

Yes

Active

1.8 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

compliant

EAR99

8542.39.00.01

Nexperia

Check for Price

Yes

Active

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP,

compliant

EAR99

8542.39.00.01

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

SOT-363

PLASTIC, SC-88, SOT-363, 6 PIN

unknown

8542.39.00.01

Check for Price

Yes

Transferred

1.8 V

8.4 ns

4.7 ns

YES

TSSOP

50 pF

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

24 mA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

TSSOP

PLASTIC, SC-88, SOT-363, 6 PIN

SOT363

compliant

8542.39.00.01

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

TSSOP,

unknown

8542.39.00.01

Check for Price

Yes

Transferred

3.3 V

4.7 ns

YES

TSSOP

50 pF

OPEN-DRAIN

BUFFER

CMOS

24 mA

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

635 µm

DUAL

PHILIPS SEMICONDUCTORS

unknown

8542.39.00.01

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

TSSOP

PLASTIC, SC-88, SOT-363, 6 PIN

SOT363

unknown

Check for Price

Yes

Active

3.3 V

8.4 ns

YES

TSSOP

50 pF

YES

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

32 mA

4 µA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TSSOP6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP-6

compliant

EAR99

8542.39.00.01

1 2 Next

Compare

74LVC2G07GW,125

Nexperia

$0.1140

Yes

Active

1.8 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP

PLASTIC, SC-88, SOT-363, 6 PIN

SOT363-2

compliant

EAR99

8542.39.00.01

Nexperia

74LVC2G07GW-Q100H

Nexperia

$0.2185

Yes

Active

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP

PLASTIC, SC-88, SOT-363, 6 PIN

SOT363-2

compliant

EAR99

8542.39.00.01

Nexperia

74LVC2G07GW

Nexperia

Check for Price

Yes

Active

1.8 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

compliant

EAR99

8542.39.00.01

Nexperia

74LVC2G07GW-Q100,125

Nexperia

Check for Price

Yes

Active

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP,

compliant

EAR99

8542.39.00.01

74LVC2G07GW-Q100

NXP Semiconductors

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

SOT-363

PLASTIC, SC-88, SOT-363, 6 PIN

unknown

8542.39.00.01

74LVC2G07GW,125

NXP Semiconductors

Check for Price

Yes

Transferred

1.8 V

8.4 ns

4.7 ns

YES

TSSOP

50 pF

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

24 mA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

TSSOP

PLASTIC, SC-88, SOT-363, 6 PIN

SOT363

compliant

8542.39.00.01

74LVC2G07GW-Q100,125

NXP Semiconductors

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

TSSOP,

unknown

8542.39.00.01

74LVC2G07GW

Philips Semiconductors

Check for Price

Yes

Transferred

3.3 V

4.7 ns

YES

TSSOP

50 pF

OPEN-DRAIN

BUFFER

CMOS

24 mA

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

635 µm

DUAL

PHILIPS SEMICONDUCTORS

unknown

8542.39.00.01

74LVC2G07GW-Q100H

NXP Semiconductors

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

TSSOP

PLASTIC, SC-88, SOT-363, 6 PIN

SOT363

unknown

74LVC2G07GW-Q100

Nexperia

Check for Price

Yes

Active

3.3 V

8.4 ns

YES

TSSOP

50 pF

YES

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

32 mA

4 µA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TSSOP6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP-6

compliant

EAR99

8542.39.00.01

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