Findchips: Parametric Search Results for 74LVC2G07GV

Parametric results for: 74LVC2G07GV under Gates

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		74LVC2G07GV,125 NXP Semiconductors
		74LVC2G07GV,125 Nexperia
		74LVC2G07GV NXP Semiconductors
		74LVC2G07GV-Q100 Nexperia
		74LVC2G07GV-Q100H Nexperia
		74LVC2G07GV-Q100H NXP Semiconductors
		74LVC2G07GV Philips Semiconductors
		74LVC2G07GV Nexperia
		74LVC2G07GV-Q100 NXP Semiconductors
		74LVC2G07GV-Q100,125 NXP Semiconductors

				Most Relevant											Technical							Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Inputs	Surface Mount	Package Code	Load Capacitance (CL)	Schmitt Trigger	Output Characteristics	Family	Logic IC Type	Technology	Max I(ol)	Power Supply Current-Max (ICC)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	HTS Code	Samacsys Manufacturer	ECCN Code

$0.1423

Yes

Transferred

1.8 V

8.4 ns

4.7 ns

YES

TSSOP

50 pF

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

24 mA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

PLASTIC, SC-74, SOT-457, TSOP-6

SOT457

compliant

8542.39.00.01

$0.1535

Yes

Active

1.8 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSOP

PLASTIC, SC-74, SOT-457, TSOP-6

SOT457

compliant

8542.39.00.01

Nexperia

Check for Price

Yes

Transferred

1.8 V

8.4 ns

4.7 ns

YES

TSSOP

50 pF

OPEN-COLLECTOR

LVC/LCX/Z

BUFFER

CMOS

24 mA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

PLASTIC, SC-74, SOT-457, TSOP-6

compliant

8542.39.00.01

EAR99

Check for Price

Yes

Active

3.3 V

8.4 ns

YES

TSOP

50 pF

YES

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

32 mA

4 µA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TSOP6,.10,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSSOP,

compliant

8542.39.00.01

Check for Price

Active

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSOP

TSSOP,

SOT457

compliant

Nexperia

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

TSSOP,

SOT457

unknown

Check for Price

Yes

Transferred

3.3 V

4.7 ns

YES

TSOP

50 pF

OPEN-DRAIN

BUFFER

CMOS

24 mA

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

MATTE TIN

GULL WING

950 µm

DUAL

PHILIPS SEMICONDUCTORS

unknown

8542.39.00.01

Check for Price

Yes

Active

1.8 V

8.4 ns

YES

TSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

compliant

8542.39.00.01

Nexperia

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

TSSOP,

unknown

8542.39.00.01

Check for Price

Active

3.3 V

8.4 ns

YES

TSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP,

unknown

8542.39.00.01

Compare

74LVC2G07GV,125

NXP Semiconductors

$0.1423

Yes

Transferred

1.8 V

8.4 ns

4.7 ns

YES

TSSOP

50 pF

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

24 mA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

PLASTIC, SC-74, SOT-457, TSOP-6

SOT457

compliant

8542.39.00.01

74LVC2G07GV,125

Nexperia

$0.1535

Yes

Active

1.8 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSOP

PLASTIC, SC-74, SOT-457, TSOP-6

SOT457

compliant

8542.39.00.01

Nexperia

74LVC2G07GV

NXP Semiconductors

Check for Price

Yes

Transferred

1.8 V

8.4 ns

4.7 ns

YES

TSSOP

50 pF

OPEN-COLLECTOR

LVC/LCX/Z

BUFFER

CMOS

24 mA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

PLASTIC, SC-74, SOT-457, TSOP-6

compliant

8542.39.00.01

EAR99

74LVC2G07GV-Q100

Nexperia

Check for Price

Yes

Active

3.3 V

8.4 ns

YES

TSOP

50 pF

YES

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

32 mA

4 µA

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TSOP6,.10,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSSOP,

compliant

8542.39.00.01

74LVC2G07GV-Q100H

Nexperia

Check for Price

Active

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSOP

TSSOP,

SOT457

compliant

Nexperia

74LVC2G07GV-Q100H

NXP Semiconductors

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

TSSOP,

SOT457

unknown

74LVC2G07GV

Philips Semiconductors

Check for Price

Yes

Transferred

3.3 V

4.7 ns

YES

TSOP

50 pF

OPEN-DRAIN

BUFFER

CMOS

24 mA

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

MATTE TIN

GULL WING

950 µm

DUAL

PHILIPS SEMICONDUCTORS

unknown

8542.39.00.01

74LVC2G07GV

Nexperia

Check for Price

Yes

Active

1.8 V

8.4 ns

YES

TSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

compliant

8542.39.00.01

Nexperia

74LVC2G07GV-Q100

NXP Semiconductors

Check for Price

Transferred

3.3 V

8.4 ns

YES

TSSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

TSSOP,

unknown

8542.39.00.01

74LVC2G07GV-Q100,125

NXP Semiconductors

Check for Price

Active

3.3 V

8.4 ns

YES

TSOP

OPEN-DRAIN

LVC/LCX/Z

BUFFER

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP,

unknown

8542.39.00.01