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74HCT4052BQ,115
Nexperia
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$0.3087 | Active | 5 V | YES | 195 Ω | 6 Ω | 72 ns | 57 ns | SP4T | CMOS | NO | 4 | 2 | 50 dB | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NEXPERIA | QFN | HVQCCN, | 16 | SOT763-1 | compliant | 8542.39.00.01 | Nexperia | ||||||||
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74HCT4052BQ,115
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | YES | -4.5 V | 195 Ω | 6 Ω | 72 ns | 57 ns | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | -5 V | -1 V | NO | 4 | 1 | 50 dB | 320 µA | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16 | 16 | SOT763-1 | compliant | 8542.39.00.01 |