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74HCT259PW,112
Nexperia
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$0.1315 | Yes | Obsolete | 5 V | 57 ns | 1 | 1 | YES | TSSOP | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NEXPERIA | TSSOP | TSSOP-16 | 16 | SOT403-1 | compliant | 8542.39.00.01 | 1995-11-01 | Nexperia | ||||||||||
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74HCT259PW,118
Nexperia
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$0.4080 | Yes | Active | 5 V | 57 ns | 1 | 1 | YES | TSSOP | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR, 13 INCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NEXPERIA | TSSOP | TSSOP-16 | 16 | SOT403-1 | compliant | 8542.39.00.01 | 1995-11-01 | Nexperia | |||||||||
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74HCT259PW,112
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 57 ns | 59 ns | 1 | 1 | YES | TSSOP | 50 pF | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | 4 mA | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | 16 | SOT403-1 | compliant | 8542.39.00.01 | |||||||
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74HCT259PW-T
Nexperia
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Check for Price | Yes | Obsolete | 5 V | 57 ns | 1 | 1 | YES | TSSOP | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NEXPERIA | TSSOP-16 | compliant | 8542.39.00.01 | 2017-02-01 | ||||||||||||||
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74HCT259PW,118
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 57 ns | 59 ns | 1 | 1 | YES | TSSOP | 50 pF | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | 20 µA | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | 16 | SOT403-1 | compliant | 8542.39.00.01 | ||||||
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74HCT259PW-Q100
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 57 ns | 1 | 1 | YES | TSSOP | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | 1 | 125 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NXP SEMICONDUCTORS | 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 | unknown | 8542.39.00.01 | ||||||||||||||||
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74HCT259PW-T
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 57 ns | 59 ns | 1 | 1 | YES | TSSOP | 50 pF | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | 20 µA | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | 16 | unknown | 8542.39.00.01 | |||||||
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74HCT259PW
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 5 V | 57 ns | 59 ns | 1 | 1 | YES | TSSOP | 50 pF | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | 4 mA | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | 16 | unknown | 8542.39.00.01 | |||||||
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74HCT259PW-Q100,11
Nexperia
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Check for Price | Active | 5 V | 57 ns | 1 | 1 | YES | TSSOP | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR, 13 INCH | NICKEL PALLADIUM GOLD SILVER | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NEXPERIA | TSSOP | TSSOP, | 16 | SOT403-1 | compliant | Nexperia | |||||||||||
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74HCT259PW-Q100,11
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 57 ns | 59 ns | 1 | 1 | YES | TSSOP | 50 pF | LOW LEVEL | HCT | D LATCH | CMOS | 1:8 DMUX FOLLOWED BY LATCH | TRUE | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | 125 °C | -40 °C | AEC-Q100 | 16 | PLASTIC/EPOXY | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 | 16 | SOT403-1 | compliant |