Parametric results for: 74ACT240 under Bus Driver/Transceivers

All Filters Additional Feature Control Type Count Direction Family JESD-30 Code JESD-609 Code Length Load Capacitance (CL) Logic IC Type Manufacturer Max I(ol) Moisture Sensitivity Level Number of Bits Number of Functions Number of Ports Number of Terminals Operating Temperature-Max Operating Temperature-Min Output Characteristics Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style Prop. Delay@Nom-Sup Propagation Delay (tpd) Supply Voltage-Nom (Vsup) Surface Mount

50 OHM LINE DRIVE CAPABILITY FOR &lt; = 10MS ONE O/P AT A TIME 5 50 OHM LINE DRIVE CAPABILITY FOR < = 10MS ONE O/P AT A TIME 3 NOT AVAILABLE IN JAPAN 1 OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION 11

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ENABLE LOW 131

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Count Direction (1)

UNIDIRECTIONAL 20

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Family (1)

ACT 229

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R-CDFP-F20 6 R-GDFP-F20 2 R-GDIP-T20 4 R-PDIP-T20 43 R-PDSO-G16 4 R-PDSO-G20 170 R-XDIP-T20 2 S-CQCC-N20 8 S-PQCC-J20 7 S-XQCC-N20 4 X-XUUC-N16 2 X-XUUC-N20 2

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e0 65 e3 26 e3/e4 1 e4 45 e6 4

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6.5 mm 43 7.2 mm 9 8.89 mm 11 12.575 mm 5 12.6 mm 23 12.8 mm 57 12.8015 mm 10 24.5 mm 3 24.51 mm 2 24.6 mm 2 24.892 mm 6 25.4 mm 5 25.905 mm 2 26.075 mm 3 26.415 mm 9

Min (mm) - Max (mm)

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Load Capacitance (CL) (1)

50 pF 171

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BUS DRIVER 254

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Manufacturer (24)

avg Semiconductors 2 Fairchild Semiconductor Corporation 36 Freescale Semiconductor 3 Ge Solid State 4 General Electric Solid State 2 Harris Semiconductor 7 Hitachi Ltd 7 Integral Research And Production Corp 2 Intersil Corporation 7 Kodenshi Corporation 2 Motorola Mobility LLC 6 Motorola Semiconductor Products 6 National Semiconductor Corporation 4 NXP Semiconductors 8 onsemi 25 Philips Semiconductors 3 Renesas Electronics Corporation 19 Rochester Electronics LLC 41 STMicroelectronics 4 Texas Instruments 48 Thomson Consumer Electronics 2 Toshiba America Electronic Components 13 Unisonic Technologies Co Ltd 4 VTC Inc 10

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24 mA 121 48 mA 10

Min (A) - Max (A)

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1 55 2A 2 3 5

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Number of Bits (1)

4 254

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Number of Functions (2)

2.0 244 8.0 10

Min - Max

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2 251

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16 6 20 248

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85.0 °C 219 125.0 °C 35

Min (°C) - Max (°C)

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-55.0 °C 35 -40.0 °C 219

Min (°C) - Max (°C)

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Output Characteristics (1)

3-STATE 254

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INVERTED 254

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CERAMIC 6 CERAMIC, GLASS-SEALED 6 CERAMIC, METAL-SEALED COFIRED 14 PLASTIC/EPOXY 224 UNSPECIFIED 4

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Package Code (9)

DFP 8 DIE 4 DIP 49 LSSOP 1 QCCJ 7 QCCN 12 SOP 112 SSOP 13 TSSOP 43

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DIP20,.3 31 LCC20,.35SQ 4 LDCC20,.4SQ 4 SOP20,.25 4 SOP20,.3 16 SOP20,.4 43 SSOP20,.25 1 SSOP20,.3 7 TSSOP20,.25 22

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RECTANGULAR 231 SQUARE 19 UNSPECIFIED 4

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CHIP CARRIER 19 FLATPACK 8 IN LINE 1 IN-LINE 48 SMALL OUTLINE 119 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 1 SMALL OUTLINE, SHRINK PITCH 11 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 43 UNCASED CHIP 4

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Prop. Delay@Nom-Sup (6)

8.5 ns 7 8.6 ns 19 9 ns 5 9.5 ns 78 10.5 ns 7 13 ns 10

Min (ns) - Max (ns)

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Propagation Delay (tpd) (5)

7.8 ns 11 8.5 ns 73 8.6 ns 15 9 ns 13 9.5 ns 115

Min (ns) - Max (ns)

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Supply Voltage-Nom (Vsup) (2)

3.3 V 1 5 V 253

Min (V) - Max (V)

265 hits Apply

Surface Mount (2)

NO 49 YES 205

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