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72V85L15PAG
Integrated Device Technology Inc
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$21.7415 | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 3.3 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 100 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP-56 | 56 | PAG56 | compliant | EAR99 | 8542.32.00.71 | 1996-03-01 | |||
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72V85L20PAG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 3.3 V | 20 ns | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G56 | e3 | 70 °C | 56 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, | 56 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||
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IDT72V851L10TF8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 40 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, SLIM, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.71 | |||||||
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72V85L15PAG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 3.3 V | 15 ns | 40 MHz | 25 ns | BI-DIRECTIONAL FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 100 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP-56 | 56 | PAG56 | compliant | EAR99 | 8542.32.00.71 | 1996-03-01 | |||
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IDT72V851L20PFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 3.3 V | 12 ns | 50 MHz | 20 ns | BI-DIRECTIONAL FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 10 mA | 40 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.63SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.63SQ,32 | 64 | compliant | EAR99 | 8542.32.00.71 | ||||||
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72V85L15PA
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 3.3 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | YES | PARALLEL | 5 mA | 100 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e0 | 1 | 70 °C | 240 | 20 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP-56 | 56 | PA56 | not_compliant | EAR99 | 8542.32.00.71 | ||||
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IDT72V85L15PAGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 147.456 kbit | 9 | 16KX9 | 3.3 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | 1 | 16000 | 16.384 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 100 µA | CMOS | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | unknown | EAR99 | 8542.32.00.71 | |||||||||||||
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IDT72V85L15PAI
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 147.456 kbit | 9 | 16KX9 | 3.3 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | 1 | 16000 | 16.384 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 100 µA | CMOS | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 240 | 20 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn85Pb15) | GULL WING | 500 µm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.71 | |||||||||||||
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IDT72V851L10PF8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 40 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.71 | |||||||
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72V851L15TFI9
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 3.3 V | 10 ns | 15 ns | OTHER FIFO | 1 | 8000 | 8.192 k | SYNCHRONOUS | YES | PARALLEL | 40 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, SLIM, TQFP-64 | 64 | compliant | EAR99 | 8542.32.00.71 |