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IDT72T51258L5BBG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 2.6214 Mbit | 40 | 64KX40 | 2.5 V | 3.6 ns | 5 ns | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B324 | Not Qualified | e1 | 3 | 70 °C | 324 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | 324 | compliant | EAR99 | 8542.32.00.71 | |||||||||
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72T51258L5BBI
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 2.6214 Mbit | 40 | 64KX40 | 2.5 V | 3.6 ns | 200 MHz | 5 ns | OTHER FIFO | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | 324 | not_compliant | EAR99 | 8542.32.00.71 | |||
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IDT72T51258L5BBI
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 2.6214 Mbit | 40 | 64KX40 | 2.5 V | 3.6 ns | 200 MHz | 5 ns | OTHER FIFO | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | 324 | not_compliant | EAR99 | 8542.32.00.71 | |||
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IDT72T51258L5BB
Integrated Device Technology Inc
|
Check for Price | No | Obsolete | 2.6214 Mbit | 40 | 64KX40 | 2.5 V | 3.6 ns | 200 MHz | 5 ns | OTHER FIFO | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B324 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn63Pb37) | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | 324 | not_compliant | EAR99 | 8542.32.00.71 | |||||
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72T51258L5BB
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 2.6214 Mbit | 40 | 64KX40 | 2.5 V | 3.6 ns | 200 MHz | 5 ns | OTHER FIFO | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B324 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | 324 | not_compliant | EAR99 | 8542.32.00.71 | BB324 | |||
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IDT72T51258L5BBGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 2.6214 Mbit | 40 | 64KX40 | 2.5 V | 3.6 ns | 5 ns | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 324 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | 324 | compliant | EAR99 | 8542.32.00.71 |