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72V271LA10TFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 294.912 kbit | 9 | 32KX9 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | RETRANSMIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 55 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LFQFP, QFP64,.47SQ,20 | 64 | compliant | EAR99 | 8542.32.00.71 | ||
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IDT72V271LA10TFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 294.912 kbit | 9 | 32KX9 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | RETRANSMIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 55 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LFQFP, QFP64,.47SQ,20 | 64 | compliant | EAR99 | 8542.32.00.71 | ||
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72V271LA10TFG8
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 294.912 kbit | 9 | 32KX9 | 3.3 V | 6.5 ns | 10 ns | RETRANSMIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | 70 °C | 64 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP-64 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||
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IDT72V271LA10TFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 294.912 kbit | 9 | 32KX9 | 3.3 V | 6.5 ns | 10 ns | RETRANSMIT; AUTO POWER DOWN | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 70 °C | 64 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LFQFP, | 64 | compliant | EAR99 | 8542.32.00.71 |