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Parametric » Memory » FIFOs

Parametric results for: 72V221L20J under FIFOs

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Manufacturer Part Number: 72v221l20j
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IDT72V221L20J
 Integrated Device Technology Inc 		Check for Price No No Obsolete 9.216 kbit 9 1KX9 3.3 V 12 ns 50 MHz 20 ns OTHER FIFO 1 1000 1.024 k SYNCHRONOUS YES PARALLEL 5 mA 20 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT72V221L20JG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.216 kbit 9 1KX9 3.3 V 12 ns 20 ns 1 1000 1.024 k SYNCHRONOUS YES PARALLEL 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
IDT72V221L20J8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 9.216 kbit 9 1KX9 3.3 V 12 ns 50 MHz 20 ns OTHER FIFO 1 1000 1.024 k SYNCHRONOUS YES PARALLEL 5 mA 20 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
72V221L20J
 Integrated Device Technology Inc 		Check for Price No No Obsolete 9.216 kbit 9 1KX9 3.3 V 12 ns 50 MHz 20 ns OTHER FIFO 1 1000 1.024 k SYNCHRONOUS YES PARALLEL 5 mA 20 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71 PL32
72V221L20JG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.216 kbit 9 1KX9 3.3 V 12 ns 50 MHz 20 ns OTHER FIFO 1 1000 1.024 k SYNCHRONOUS YES PARALLEL 5 mA 20 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71
72V221L20JG8
 Integrated Device Technology Inc 		Check for Price Yes Transferred 9.216 kbit 9 1KX9 3.3 V 12 ns 20 ns 1 1000 1.024 k SYNCHRONOUS YES PARALLEL 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QCCJ, compliant EAR99 8542.32.00.71
72V221L20J8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 9.216 kbit 9 1KX9 3.3 V 12 ns 50 MHz 20 ns OTHER FIFO 1 1000 1.024 k SYNCHRONOUS YES PARALLEL 5 mA 20 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71 PL32
IDT72V221L20JG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.216 kbit 9 1KX9 3.3 V 12 ns 20 ns 1 1000 1.024 k SYNCHRONOUS YES PARALLEL 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 70 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71