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Manufacturer Part Number: 72t4
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72T40118L5BB
 Integrated Device Technology Inc 		Check for Price No No Obsolete 5.2429 Mbit 40 128KX40 2.5 V 3.6 ns 200 MHz 5 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH: 10 AND 20 1 128000 131.072 k SYNCHRONOUS YES PARALLEL 50 mA 60 µA 2.625 V 2.375 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 30 208 PLASTIC/EPOXY BGA BGA208,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208 208 BB208 not_compliant EAR99 8542.32.00.71
72T40118L5BBG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 5.2429 Mbit 40 128KX40 2.5 V 3.6 ns 200 MHz 5 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH: 10 AND 20 1 128000 131.072 k SYNCHRONOUS YES PARALLEL 10 mA 60 µA 2.625 V 2.375 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 208 PLASTIC/EPOXY BGA BGA208,16X16,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208 208 BBG208 compliant EAR99 8542.32.00.71
72T4088L6.7BBI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 655.36 kbit 40 16KX40 2.5 V 3.8 ns 6.7 ns OTHER FIFO 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 60 µA 2.625 V 2.375 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 208 compliant EAR99 8542.32.00.71
72T4088L5BBGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 655.36 kbit 40 16KX40 2.5 V 3.6 ns 5 ns OTHER FIFO 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 60 µA 2.625 V 2.375 V CMOS INDUSTRIAL S-PBGA-B208 e1 3 85 °C -40 °C 260 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN SILVER COPPER BALL BOTTOM INTEGRATED DEVICE TECHNOLOGY INC PBGA BGA, 208 BBG208 compliant EAR99 8542.32.00.71
IDT72T4098L6.7BB
 Integrated Device Technology Inc 		Check for Price No Obsolete 1.3107 Mbit 40 32KX40 2.5 V 3.8 ns 6.7 ns OTHER FIFO 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 60 µA 2.625 V 2.375 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 70 °C 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 208 compliant EAR99 8542.32.00.71
IDT72T4088L6.7BBI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 655.36 kbit 40 16KX40 2.5 V 3.8 ns 6.7 ns OTHER FIFO 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 60 µA 2.625 V 2.375 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 208 compliant EAR99 8542.32.00.71
IDT72T4088L6-7BBGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 655.36 kbit 40 16KX40 2.5 V 3.8 ns 6.7 ns ALTERNATIVE MEMORY WIDTH: 10 AND 20 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 2.625 V 2.375 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208 208 compliant EAR99 8542.32.00.71
IDT72T4098L6-7BBG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 1.3107 Mbit 40 32KX40 2.5 V 3.8 ns 6.7 ns ALTERNATIVE MEMORY WIDTH: 10 AND 20 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 2.625 V 2.375 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208 208 compliant EAR99 8542.32.00.71
IDT72T4098L4BBG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 1.3107 Mbit 40 32KX40 2.5 V 3.2 ns 4 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH: 10 AND 20 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 60 µA 2.625 V 2.375 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208 208 compliant EAR99 8542.32.00.71
IDT72T40108L6-7BB
 Integrated Device Technology Inc 		Check for Price No Obsolete 2.6214 Mbit 40 64KX40 2.5 V 3.8 ns 150 MHz 6.7 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH: 10 AND 20 1 64000 65.536 k SYNCHRONOUS YES PARALLEL 50 mA 60 µA 2.625 V 2.375 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 30 208 PLASTIC/EPOXY BGA BGA208,16X16,40 SQUARE GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.97 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208 208 not_compliant EAR99 8542.32.00.71
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