Parametric results for: 72271LA20PFI under FIFOs

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Manufacturer Part Number: 72271la20pfi
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72271LA20PFI9
Integrated Device Technology Inc
Check for Price No No Obsolete 294.912 kbit 9 32KX9 5 V 12 ns 20 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 75 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e0 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-64 64 compliant EAR99 8542.32.00.71
72271LA20PFI8
Integrated Device Technology Inc
Check for Price No No Obsolete 294.912 kbit 9 32KX9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 17 mA 75 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e0 3 85 °C -40 °C 240 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP PLASTIC, TQFP-64 64 not_compliant EAR99 8542.32.00.71 PN64
IDT72271LA20PFI
Integrated Device Technology Inc
Check for Price No No Obsolete 294.912 kbit 9 32KX9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 17 mA 75 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e0 3 85 °C -40 °C 240 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-64 64 not_compliant EAR99 8542.32.00.71
72271LA20PFI
Integrated Device Technology Inc
Check for Price No No Obsolete 294.912 kbit 9 32KX9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 17 mA 75 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e0 3 85 °C -40 °C 240 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP PLASTIC, TQFP-64 64 not_compliant EAR99 8542.32.00.71 PN64
IDT72271LA20PFI9
Integrated Device Technology Inc
Check for Price No No Obsolete 294.912 kbit 9 32KX9 5 V 12 ns 20 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 75 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e0 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-64 64 compliant EAR99 8542.32.00.71
IDT72271LA20PFI8
Integrated Device Technology Inc
Check for Price No No Obsolete 294.912 kbit 9 32KX9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 17 mA 75 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e0 3 85 °C -40 °C 240 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-64 64 not_compliant EAR99 8542.32.00.71