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Manufacturer Part Number: 72265la10tfg
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IDT72265LA10TFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 294.912 kbit 18 16KX18 5 V 8 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 80 µA 5.5 V 4 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) - annealed GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LFQFP, QFP64,.47SQ,20 64 compliant EAR99 8542.32.00.71 1994-01-01
72265LA10TFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 294.912 kbit 18 16KX18 5 V 8 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 80 µA 5.5 V 4 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP STQFP-64 64 compliant EAR99 8542.32.00.71 1994-01-01 PPG64
72265LA10TFG
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 294.912 kbit 18 16KX18 5 V 8 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 80 µA 5.5 V 4 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm RENESAS ELECTRONICS CORP TQFP STQFP-64 64 compliant NLR 8542320071 PPG64 Renesas Electronics
72265LA10TFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 294.912 kbit 18 16KX18 5 V 8 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP TQFP-64 64 compliant EAR99 8542.32.00.71 1994-01-01 PPG64
IDT72265LA10TFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 294.912 kbit 18 16KX18 5 V 8 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) - annealed GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LFQFP, QFP64,.47SQ,20 64 compliant EAR99 8542.32.00.71 1994-01-01
72265LA10TFG8
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 294.912 kbit 18 16KX18 5 V 8 ns 100 MHz 10 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 80 µA 5.5 V 4 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm RENESAS ELECTRONICS CORP TQFP STQFP-64 64 compliant NLR 8542320071 PPG64 Renesas Electronics