Parametric results for: 72261LA15PFG under FIFOs

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Manufacturer Part Number: 72261la15pfg
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72261LA15PFG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 5 V 10 ns 66.7 MHz 15 ns OTHER FIFO 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 75 µA 5.5 V 4.5 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP64,.66SQ,32 64 compliant EAR99 8542.32.00.71
IDT72261LA15PFG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 5 V 10 ns 15 ns RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 40 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 64 compliant EAR99 8542.32.00.71
72261LA15PFG8
Integrated Device Technology Inc
Check for Price Yes Transferred 294.912 kbit 9 32KX9 5 V 10 ns 15 ns RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL S-PQFP-G64 70 °C 260 30 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC LQFP, compliant EAR99 8542.32.00.71
IDT72261LA15PFG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 5 V 10 ns 66.7 MHz 15 ns OTHER FIFO 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 75 µA 5.5 V 4.5 V CMOS COMMERCIAL S-PQFP-G64 Not Qualified e3 3 70 °C 260 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP64,.66SQ,32 64 compliant EAR99 8542.32.00.71
IDT72261LA15PFGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 5 V 10 ns 15 ns RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 64 compliant EAR99 8542.32.00.71
IDT72261LA15PFGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 5 V 10 ns 66.7 MHz 15 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 75 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 260 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP64,.66SQ,32 64 compliant EAR99 8542.32.00.71
72261LA15PFGI8
Integrated Device Technology Inc
Check for Price Yes Transferred 294.912 kbit 9 32KX9 5 V 10 ns 15 ns RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 85 °C -40 °C 260 30 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC LQFP, compliant EAR99 8542.32.00.71
72261LA15PFGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 5 V 10 ns 66.7 MHz 15 ns OTHER FIFO RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH 1 16000 16.384 k SYNCHRONOUS YES PARALLEL 20 mA 75 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 260 30 64 PLASTIC/EPOXY LQFP QFP64,.66SQ,32 SQUARE FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 800 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP64,.66SQ,32 64 compliant EAR99 8542.32.00.71