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72261LA15PFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 147.456 kbit | 9 | 16KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 16000 | 16.384 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 75 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.66SQ,32 | 64 | compliant | EAR99 | 8542.32.00.71 | ||||
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IDT72261LA15PFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 147.456 kbit | 9 | 16KX9 | 5 V | 10 ns | 15 ns | RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH | 1 | 16000 | 16.384 k | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 64 | compliant | EAR99 | 8542.32.00.71 | ||||||||
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72261LA15PFG8
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 294.912 kbit | 9 | 32KX9 | 5 V | 10 ns | 15 ns | RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | LQFP, | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||
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IDT72261LA15PFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 147.456 kbit | 9 | 16KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 16000 | 16.384 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 75 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.66SQ,32 | 64 | compliant | EAR99 | 8542.32.00.71 | ||||
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IDT72261LA15PFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 147.456 kbit | 9 | 16KX9 | 5 V | 10 ns | 15 ns | RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH | 1 | 16000 | 16.384 k | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 64 | compliant | EAR99 | 8542.32.00.71 | |||||||
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IDT72261LA15PFGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 147.456 kbit | 9 | 16KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH | 1 | 16000 | 16.384 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 75 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.66SQ,32 | 64 | compliant | EAR99 | 8542.32.00.71 | ||
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72261LA15PFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 294.912 kbit | 9 | 32KX9 | 5 V | 10 ns | 15 ns | RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | LQFP, | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||
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72261LA15PFGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 147.456 kbit | 9 | 16KX9 | 5 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH | 1 | 16000 | 16.384 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 75 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.66SQ,32 | 64 | compliant | EAR99 | 8542.32.00.71 |