Findchips: Parametric Search Results for 7201LA50DB


Select Parts		Part Number

		7201LA50DB Integrated Device Technology Inc
		7201LA50DB8 Integrated Device Technology Inc
		IDT7201LA50DB Integrated Device Technology Inc
		IDT7201LA50DB8 Integrated Device Technology Inc
		7201LA50DB Renesas Electronics Corporation
		IDT7201LA50DBG Integrated Device Technology Inc
		7201LA50DBG Integrated Device Technology Inc

				Most Relevant							Technical															Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Cycle Time	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Samacsys Manufacturer

$19.0272

Transferred

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

OTHER FIFO

RETRANSMIT

512

512 words

ASYNCHRONOUS

PARALLEL

900 µA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

240

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

CDIP

0.600 INCH, CERAMIC, DIP-28

CD28

not_compliant

EAR99

8542.32.00.71

1988-01-01

Check for Price

Obsolete

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

OTHER FIFO

512

512 words

ASYNCHRONOUS

PARALLEL

15 mA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

DIP-28

not_compliant

EAR99

8542.32.00.71

Check for Price

Transferred

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

OTHER FIFO

RETRANSMIT

512

512 words

ASYNCHRONOUS

3-STATE

PARALLEL

900 µA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP28,.6

not_compliant

EAR99

8542.32.00.71

1988-01-01

Check for Price

Obsolete

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

OTHER FIFO

512

512 words

ASYNCHRONOUS

PARALLEL

15 mA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

DIP-28

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

BI-DIRECTIONAL FIFO

RETRANSMIT

512

512 words

ASYNCHRONOUS

PARALLEL

900 µA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

240

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

RENESAS ELECTRONICS CORP

CDIP

0.600 INCH, CERAMIC, DIP-28

CD28

not_compliant

NLR

8542320071

Renesas Electronics

Check for Price

Yes

Obsolete

4.608 kbit

512X9

5 V

50 ns

65 ns

RETRANSMIT

512

512 words

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

36.864 kbit

4KX9

5 V

80 ns

100 ns

OTHER FIFO

RETRANSMIT

4000

512 words

ASYNCHRONOUS

YES

PARALLEL

120 µA

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

compliant

EAR99

8542.32.00.71

Compare

7201LA50DB

Integrated Device Technology Inc

$19.0272

Transferred

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

OTHER FIFO

RETRANSMIT

512

512 words

ASYNCHRONOUS

PARALLEL

900 µA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

240

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

CDIP

0.600 INCH, CERAMIC, DIP-28

CD28

not_compliant

EAR99

8542.32.00.71

1988-01-01

7201LA50DB8

Integrated Device Technology Inc

Check for Price

Obsolete

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

OTHER FIFO

512

512 words

ASYNCHRONOUS

PARALLEL

15 mA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

DIP-28

not_compliant

EAR99

8542.32.00.71

IDT7201LA50DB

Integrated Device Technology Inc

Check for Price

Transferred

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

OTHER FIFO

RETRANSMIT

512

512 words

ASYNCHRONOUS

3-STATE

PARALLEL

900 µA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP28,.6

not_compliant

EAR99

8542.32.00.71

1988-01-01

IDT7201LA50DB8

Integrated Device Technology Inc

Check for Price

Obsolete

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

OTHER FIFO

512

512 words

ASYNCHRONOUS

PARALLEL

15 mA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

DIP-28

not_compliant

EAR99

8542.32.00.71

7201LA50DB

Renesas Electronics Corporation

Check for Price

Obsolete

4.608 kbit

512X9

5 V

50 ns

15 MHz

65 ns

BI-DIRECTIONAL FIFO

RETRANSMIT

512

512 words

ASYNCHRONOUS

PARALLEL

900 µA

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

240

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

RENESAS ELECTRONICS CORP

CDIP

0.600 INCH, CERAMIC, DIP-28

CD28

not_compliant

NLR

8542320071

Renesas Electronics

IDT7201LA50DBG

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

4.608 kbit

512X9

5 V

50 ns

65 ns

RETRANSMIT

512

512 words

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

compliant

EAR99

8542.32.00.71

7201LA50DBG

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

36.864 kbit

4KX9

5 V

80 ns

100 ns

OTHER FIFO

RETRANSMIT

4000

512 words

ASYNCHRONOUS

YES

PARALLEL

120 µA

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

compliant

EAR99

8542.32.00.71

Parametric results for: 7201LA50DB under FIFOs