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Parametric » Memory » FIFOs

Parametric results for: 7201LA25J under FIFOs

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Manufacturer Part Number: 7201la25j
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7201LA25JGI8
 Integrated Device Technology Inc 		Check for Price Buy Yes Yes Transferred 4.608 kbit 9 512X9 5 V 25 ns 35 ns RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
IDT7201LA25JI8
 Integrated Device Technology Inc 		Check for Price Buy No No Obsolete 4.608 kbit 9 512X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT7201LA25JI
 Integrated Device Technology Inc 		Check for Price Buy No No Obsolete 4.608 kbit 9 512X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
7201LA25JI8
 Integrated Device Technology Inc 		Check for Price Buy No No Obsolete 4.608 kbit 9 512X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71 PL32
IDT7201LA25JGI
 Integrated Device Technology Inc 		Check for Price Buy Yes Yes Transferred 4.608 kbit 9 512X9 5 V 25 ns 35 ns RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
IDT7201LA25JGI8
 Integrated Device Technology Inc 		Check for Price Buy Yes Yes Transferred 4.608 kbit 9 512X9 5 V 25 ns 35 ns BI-DIRECTIONAL FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
7201LA25JGI
 Integrated Device Technology Inc 		Check for Price Buy Yes Yes Transferred 4.608 kbit 9 512X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71
7201LA25JG
 Integrated Device Technology Inc 		Check for Price Buy Yes Yes Transferred 4.608 kbit 9 512X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71
7201LA25J
 Integrated Device Technology Inc 		Check for Price Buy No No Obsolete 4.608 kbit 9 512X9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71 PL32
IDT7201LA25JG
 Integrated Device Technology Inc 		Check for Price Buy Yes Yes Transferred 4.608 kbit 9 512X9 5 V 25 ns 35 ns RETRANSMIT 1 512 512 words ASYNCHRONOUS 3-STATE NO PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 70 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
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