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Manufacturer Part Number: 71v67903s85pfg
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71V67903S85PFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 210 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, 1.40 MM, GREEN, PLASTIC, MO-136DJ, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V67903S85PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 190 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP100,.63X.87 100 compliant 3A991.B.2.A 8542.32.00.41
71V67903S85PFGI
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 210 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 PKG100 compliant NLR 8542320041 Renesas Electronics
71V67903S85PFG
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 190 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 PKG100 compliant NLR 8542320041 Renesas Electronics
IDT71V67903S85PFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 190 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP100,.63X.87 100 compliant 3A991.B.2.A 8542.32.00.41
71V67903S85PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 190 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, 1.40 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V67903S85PFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 190 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, 1.40 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V67903S85PFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 210 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, 1.40 MM, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V67903S85PFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 210 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, QFP100,.63X.87 100 compliant 3A991.B.2.A 8542.32.00.41
71V67903S85PFGI8
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 210 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 PKG100 compliant NLR 8542320041 Renesas Electronics
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