Findchips: Parametric Search Results for 71v3576s133pfgi8


Select Parts		Part Number

		71V3576S133PFGI8 Renesas Electronics Corporation
		71V3576S133PFGI8 Integrated Device Technology Inc
		IDT71V3576S133PFGI8 Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Date Of Intro

Check for Price

Yes

Obsolete

4.7186 Mbit

128KX36

3.3 V

4.2 ns

133 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

RENESAS ELECTRONICS CORP

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

NLR

8542320041

Renesas Electronics

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

4.2 ns

133 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

4.2 ns

133 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

Compare

71V3576S133PFGI8

Renesas Electronics Corporation

Check for Price

Yes

Obsolete

4.7186 Mbit

128KX36

3.3 V

4.2 ns

133 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

RENESAS ELECTRONICS CORP

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

NLR

8542320041

Renesas Electronics

71V3576S133PFGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

4.2 ns

133 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

IDT71V3576S133PFGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

4.2 ns

133 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

Parametric results for: 71v3576s133pfgi8 under SRAMs