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Parametric » Memory » SRAMs

Parametric results for: 71v3576 under SRAMs

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Manufacturer Part Number: 71v3576
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71V35761S166PFG
 Integrated Device Technology Inc 		$4.0018 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 320 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V3576S150PFGI
 Integrated Device Technology Inc 		$4.5314 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.8 ns 150 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-F100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY QFF QFP100,.63X.87 RECTANGULAR FLATPACK YES MATTE TIN FLAT 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 20 X 14 MM, ROHS COMPLIANT, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V3576S133PFG
 Integrated Device Technology Inc 		$4.5838 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 4.2 ns 133 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-F100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY QFF QFP100,.63X.87 RECTANGULAR FLATPACK YES MATTE TIN FLAT 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 20 X 14 MM, ROHS COMPLIANT, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V35761SA166BQGI
 Integrated Device Technology Inc 		$7.7007 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 330 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC CABGA FPBGA-165 165 BQG165 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V35761S200BGI8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns CACHE SRAM 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, POWER, PLASTIC, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41
71V3576SA150BG8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.8 ns 150 MHz STANDARD SRAM COMMON 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 295 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V35761SA183BGI
 Integrated Device Technology Inc 		Check for Price No Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns 183 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 350 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
IDT71V3576SA150BG
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.8 ns 150 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 295 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
71V35761YSA200BQ
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3576YSA133BGGI
 Integrated Device Technology Inc 		Check for Price Obsolete INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 unknown 3A991.B.2.A 8542.32.00.41
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