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71V67803S133BQG8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 4.2 ns | 133 MHz | STANDARD SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 50 mA | 3.14 V | 260 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | RENESAS ELECTRONICS CORP | CABGA | 165 | BQG165 | compliant | NLR | 8542320041 | Renesas Electronics | ||||
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71V67803S133BQG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 18 | 512KX18 | 3.3 V | 4.2 ns | 133 MHz | STANDARD SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 50 mA | 3.14 V | 260 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | 165 | BQG165 | compliant | 3A991.B.2.A | 8542.32.00.41 | 13 X 15 MM, ROHS COMPLIANT, BGA-165 | 1997-09-16 |