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71V3577S75BQG8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Active | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 7.5 ns | 117 MHz | STANDARD SRAM | FLOW THROUGH ARCHITECTURE | COMMON | 1 | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | NO | 30 mA | 3.14 V | 255 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | e1 | 3 | 70 °C | 260 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | RENESAS ELECTRONICS CORP | CABGA | CABGA-165 | 165 | BQG165 | compliant | NLR | 8542320041 | Renesas Electronics | |||
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71V3577S75BQG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 7.5 ns | CACHE SRAM | FLOW THROUGH ARCHITECTURE | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | e1 | 3 | 70 °C | 260 | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | ROHS COMPLIANT, FBGA-165 | 165 | BQG165 | compliant | 3A991.B.2.A | 8542.32.00.41 | 1997-09-16 |