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71V35761SA200BGG8
Integrated Device Technology Inc
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$8.1530 | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 360 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | GREEN, BGA-119 | 119 | BGG119 | compliant | 3A991.B.2.A | 8542.32.00.41 | 1997-09-16 | ||||
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71V35761SA200BG8
Integrated Device Technology Inc
|
$8.1530 | No | No | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 360 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | BGA-119 | 119 | BG119 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | 1997-09-16 | ||||
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71V35761SA200BG
Integrated Device Technology Inc
|
$8.9652 | No | No | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 360 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | BGA-119 | 119 | BG119 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | 1997-09-16 | ||||
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71V35761SA200BGG
Integrated Device Technology Inc
|
$8.9652 | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 360 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | GREEN, BGA-119 | 119 | BGG119 | compliant | 3A991.B.2.A | 8542.32.00.41 | 1997-09-16 | ||||
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IDT71V35761SA200BG
Integrated Device Technology Inc
|
Check for Price | No | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 360 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA119,7X17,50 | 119 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | 1997-09-16 | ||||||
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71V35761SA200BGGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | CACHE SRAM | PIPELINED | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B119 | e1 | 3 | 85 °C | -40 °C | 260 | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | BGA-119 | 119 | BGG119 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||||
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IDT71V35761SA200BGG
Integrated Device Technology Inc
|
Check for Price | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | CACHE SRAM | PIPELINED ARCHITECTURE | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 70 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||||||
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71V35761SA200BGI8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | CACHE SRAM | e0 | 3 | 225 | 20 | TIN LEAD | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | 119 | BG119 | not_compliant | EAR99 | 8542.32.00.41 | |||||||||||||||||||||||||||||||||||||||||||
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71V35761SA200BGG8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | End Of Life | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 360 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | RENESAS ELECTRONICS CORP | PBGA | 119 | BGG119 | compliant | NLR | 8542320041 | Renesas Electronics | |||||
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71V35761SA200BG
Renesas Electronics Corporation
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Check for Price | No | No | End Of Life | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.1 ns | 200 MHz | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 360 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | RENESAS ELECTRONICS CORP | PBGA | 119 | BG119 | not_compliant | NLR | 8542320041 | Renesas Electronics |