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Parametric » Memory » SRAMs

Parametric results for: 71V35761S200PF under SRAMs

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Manufacturer Part Number: 71v35761s200pf
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IDT71V35761S200PFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V35761S200PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V35761S200PFI8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C 240 20 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
71V35761S200PFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 compliant 3A991.B.2.A 8542.32.00.41 PKG100 1997-09-16
IDT71V35761S200PF
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
71V35761S200PF8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
71V35761S200PF9
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
71V35761S200PF
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V35761S200PF8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
71V35761S200PFG
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 compliant NLR 8542320041 PKG100 Renesas Electronics
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