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Parametric » Memory » SRAMs

Parametric results for: 71V25761S200BG under SRAMs

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Manufacturer Part Number: 71v25761s200bg
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71V25761S200BG8
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V25761S200BG8
 Renesas Electronics Corporation 		Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm RENESAS ELECTRONICS CORP PBGA 14 X 22 MM, PLASTIC, BGA-119 119 BG119 not_compliant NLR 8542320041 Renesas Electronics
71V25761S200BG
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
IDT71V25761S200BGG
 Integrated Device Technology Inc 		Check for Price Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 unknown 3A991.B.2.A 8542.32.00.41
71V25761S200BGG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 compliant 3A991.B.2.A 8542.32.00.41
71V25761S200BG
 Renesas Electronics Corporation 		Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm RENESAS ELECTRONICS CORP PBGA BGA-119 119 BG119 not_compliant NLR 8542320041 Renesas Electronics
IDT71V25761S200BG8
 Integrated Device Technology Inc 		Check for Price No Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V25761S200BGG8
 Integrated Device Technology Inc 		Check for Price Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 e1 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA, compliant 3A991.B.2.A 8542.32.00.41
71V25761S200BG
 Rochester Electronics LLC 		Check for Price No No Active 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 COMMERCIAL e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm ROCHESTER ELECTRONICS LLC BGA BGA-119 119 unknown
IDT71V25761S200BG
 Integrated Device Technology Inc 		Check for Price No Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16