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Manufacturer Part Number: 71v2558xs100bg
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IDT71V2558XS100BGI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns ZBT SRAM PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
71V2558XS100BGGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 22 X 14 MM, ROHS COMPLIANT, PLASTIC, MS-028AA, BGA-119 119 compliant 3A991.B.2.A 8542.32.00.41
71V2558XS100BGI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 1.8 V 260 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
71V2558XS100BGG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 22 X 14 MM, ROHS COMPLIANT, PLASTIC, MS-028AA, BGA-119 119 compliant 3A991.B.2.A 8542.32.00.41
71V2558XS100BGG8
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41
71V2558XS100BGGI8
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 260 µA CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41
IDT71V2558XS100BG
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns ZBT SRAM PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
71V2558XS100BG
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 1.8 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41