Filter Your Search
1 - 10 of 12 results
|
71T75602S133BGG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 2.38 V | 195 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | 14 X 22 MM, GREEN, MS-028AA, BGA-119 | 119 | BGG119 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
|
71T75602S133BGGI8
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 60 mA | 2.38 V | 215 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 | 119 | BGG119 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
|
71T75602S133BGGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 60 mA | 2.38 V | 215 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | 14 X 22 MM, GREEN, MS-028AA, BGA-119 | 119 | BGG119 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
|
IDT71T75602S133BGG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | ZBT SRAM | PIPELINED ARCHITECTURE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 2.625 V | 2.375 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||
|
IDT71T75602S133BGGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | ZBT SRAM | PIPELINED ARCHITECTURE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
|
71T75602S133BGG
Renesas Electronics Corporation
|
Check for Price | Yes | Yes | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 2.38 V | 195 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | RENESAS ELECTRONICS CORP | PBGA | 119 | BGG119 | compliant | NLR | 8542320041 | Renesas Electronics | ||||
|
71T75602S133BGG8
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 2.38 V | 195 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 | 119 | BGG119 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
|
71T75602S133BGG8
Renesas Electronics Corporation
|
Check for Price | Yes | Yes | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 2.38 V | 195 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | RENESAS ELECTRONICS CORP | PBGA | 119 | BGG119 | compliant | NLR | 8542320041 | Renesas Electronics | ||||
|
71T75602S133BGGI
Renesas Electronics Corporation
|
Check for Price | Yes | Yes | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 60 mA | 2.38 V | 215 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | RENESAS ELECTRONICS CORP | PBGA | 119 | BGG119 | compliant | NLR | 8542320041 | Renesas Electronics | |||
|
IDT71T75602S133BGGI8
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 2.5 V | 4.2 ns | ZBT SRAM | PIPELINED ARCHITECTURE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 |