Parametric results for: 71T75602S133BGG under SRAMs

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Manufacturer Part Number: 71t75602s133bgg
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71T75602S133BGG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, GREEN, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
71T75602S133BGGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 215 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
71T75602S133BGGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 215 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, GREEN, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
IDT71T75602S133BGG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns ZBT SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71T75602S133BGGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns ZBT SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
71T75602S133BGG
Renesas Electronics Corporation
Check for Price Yes Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm RENESAS ELECTRONICS CORP PBGA 119 BGG119 compliant NLR 8542320041 Renesas Electronics
71T75602S133BGG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
71T75602S133BGG8
Renesas Electronics Corporation
Check for Price Yes Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm RENESAS ELECTRONICS CORP PBGA 119 BGG119 compliant NLR 8542320041 Renesas Electronics
71T75602S133BGGI
Renesas Electronics Corporation
Check for Price Yes Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 215 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm RENESAS ELECTRONICS CORP PBGA 119 BGG119 compliant NLR 8542320041 Renesas Electronics
IDT71T75602S133BGGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 4.2 ns ZBT SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41