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71P74604S250BQ8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 375 mA | 1.7 V | 1.1 mA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 225 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | 13 X 15 MM, 1 MM PITCH, FBGA-165 | 165 | BQ165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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71P74604S250BQ
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | 13 X 15 MM, 1 MM PITCH, FBGA-165 | 165 | BQ165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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71P74604S250BQG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 375 mA | 1.7 V | 1.1 mA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | 13 X 15 MM, 1 MM PITCH, GREEN, FBGA-165 | 165 | BQG165 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||
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71P74604S250BQG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 375 mA | 1.7 V | 1.1 mA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | 13 X 15 MM, 1 MM PITCH, GREEN, FBGA-165 | 165 | BQG165 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||
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IDT71P74604S250BQ
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 375 mA | 1.7 V | 1.1 mA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 13 X 15 MM, 1 MM PITCH, FBGA-165 | 165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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71P74604S250BQGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | QDR SRAM | e1 | 3 | 260 | TIN SILVER COPPER | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | 165 | BQG165 | compliant | EAR99 | 8542.32.00.41 |