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7133LA25JGI
Renesas Electronics Corporation
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$32.1426 | Yes | Yes | Active | 32.768 kbit | 16 | 2KX16 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 300 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQCC-J68 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 4.572 mm | 24.2062 mm | 24.2062 mm | RENESAS ELECTRONICS CORP | PLCC | 68 | PLG68 | compliant | NLR | 8542320041 | Renesas Electronics | |||||||
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7133LA20JG
Renesas Electronics Corporation
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$41.2828 | Yes | Yes | Active | 32.768 kbit | 16 | 2KX16 | 5 V | 20 ns | MULTI-PORT SRAM | AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.5 mA | 2 V | 280 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J68 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 4.572 mm | 24.2062 mm | 24.2062 mm | RENESAS ELECTRONICS CORP | PLCC | 68 | PLG68 | compliant | NLR | 8542320041 | Renesas Electronics | |||||||
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7133LA25PFGI
Renesas Electronics Corporation
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$52.6015 | Yes | Yes | Active | 32.768 kbit | 16 | 2KX16 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 300 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | RENESAS ELECTRONICS CORP | TQFP | 100 | PNG100 | compliant | NLR | 8542320041 | Renesas Electronics | |||||||
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7133LA70FG8
Integrated Device Technology Inc
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Check for Price | Transferred | 32.768 kbit | 16 | 2KX16 | 5 V | 70 ns | MULTI-PORT SRAM | 1 | 2000 | 2.048 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-F68 | 70 °C | 68 | PLASTIC/EPOXY | QFF | SQUARE | FLATPACK | YES | FLAT | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | QFF, | ||||||||||||||||||||||||||||||
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IDT7133LA55FB
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 32.768 kbit | 16 | 2KX16 | 5 V | 55 ns | MULTI-PORT SRAM | AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 4 mA | 2 V | 285 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CQFP-F68 | Not Qualified | e0 | 125 °C | -55 °C | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | QFF | QFL68,.95SQ | SQUARE | FLATPACK | YES | TIN LEAD | FLAT | 1.27 mm | QUAD | 3.683 mm | 24.0792 mm | 24.0792 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 68 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | QFF, QFL68,.95SQ | 1988-01-01 | |||||||
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7133LA20JG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 32.768 kbit | 16 | 2KX16 | 5 V | 20 ns | MULTI-PORT SRAM | AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.5 mA | 2 V | 280 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J68 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 4.572 mm | 24.2062 mm | 24.2062 mm | INTEGRATED DEVICE TECHNOLOGY INC | PLCC | 68 | PLG68 | compliant | EAR99 | 8542.32.00.41 | 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-68 | 1988-01-01 | ||||||
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7133LA35PFB
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 32.768 kbit | 16 | 2KX16 | 5 V | 35 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 295 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-PQFP-G100 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 240 | MIL-PRF-38535 | 20 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Tin/Lead (Sn85Pb15) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 100 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | LFQFP, QFP100,.63SQ,20 | |||||||
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7133LA20PFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 32.768 kbit | 16 | 2KX16 | 5 V | 20 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.5 mA | 2 V | 280 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 100 | PLASTIC/EPOXY | QFP | QFP100,.63SQ,20 | SQUARE | FLATPACK | YES | TIN | GULL WING | 500 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 100 | PNG100 | compliant | EAR99 | 8542.32.00.41 | TQFP-100 | 1988-01-01 | |||||||||||
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IDT7133LA55L68
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 32.768 kbit | 16 | 2KX16 | 5 V | 55 ns | MULTI-PORT SRAM | AUTOMATIC POWER-DOWN | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 2 V | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQCC-N68 | Not Qualified | 1 | 70 °C | 68 | CERAMIC, METAL-SEALED COFIRED | QCCN | SQUARE | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 24.13 mm | 24.13 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | 68 | not_compliant | EAR99 | 8542.32.00.41 | LCC-68 | |||||||||||||||
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7133LA35FG8
Integrated Device Technology Inc
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Check for Price | Transferred | 32.768 kbit | 16 | 2KX16 | 5 V | 35 ns | MULTI-PORT SRAM | 1 | 2000 | 2.048 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-F68 | 70 °C | 68 | PLASTIC/EPOXY | QFF | SQUARE | FLATPACK | YES | FLAT | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | QFF, |