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IDT71321LA25TFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 16.384 kbit | 8 | 2KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 220 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LFQFP, QFP64,.47SQ,20 | 64 | compliant | EAR99 | 8542.32.00.41 | 1988-01-01 | ||||
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71321LA25TFGI8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 220 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | RENESAS ELECTRONICS CORP | TQFP | 64 | compliant | NLR | 8542320041 | PPG64 | Renesas Electronics | ||||
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71321LA25TFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 16.384 kbit | 8 | 2KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 220 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | STQFP-64 | 64 | compliant | EAR99 | 8542.32.00.41 | 1988-01-01 | PPG64 |