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IDT7130SA70F
Integrated Device Technology Inc
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IDT7130SA70C
Integrated Device Technology Inc
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IDT7130SA70CB
Integrated Device Technology Inc
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IDT7130SA70XC
Integrated Device Technology Inc
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IDT7130SA70L52B
Integrated Device Technology Inc
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IDT7130SA70PG
Integrated Device Technology Inc
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7130SA70XCB
Integrated Device Technology Inc
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7130SA70XC
Integrated Device Technology Inc
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IDT7130SA70CG
Integrated Device Technology Inc
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IDT7130SA70L52
Integrated Device Technology Inc
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| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max
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Memory IC Type
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Additional Feature
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I/O Type
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Number of Functions | Number of Ports | Number of Words Code | Number of Words |
Operating Mode
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Output Characteristics
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Output Enable
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Parallel/Serial
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Standby Current-Max
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Standby Voltage-Min
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Operating Temperature-Max
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Operating Temperature-Min
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Screening Level
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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| No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 180 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQFP-F48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC, METAL-SEALED COFIRED | QFF | QFL48,.75SQ | SQUARE | FLATPACK | YES | TIN LEAD | FLAT | 1.27 mm | QUAD | 2.7432 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | QFF, QFL48,.75SQ | 48 | not_compliant | EAR99 | 8542.32.00.41 | |||||
| No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 180 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CDIP-T48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 60.96 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, DIP48,.6 | 48 | not_compliant | EAR99 | 8542.32.00.41 | |||
| No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 30 mA | 4.5 V | 225 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T48 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 48 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 60.96 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-48 | 48 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | |
| No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | COMMON | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 180 µA | CMOS | COMMERCIAL | R-XDIP-T48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC | SDIP | SDIP48,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.78 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.41 | ||||||||||||||||
| No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 30 mA | 4.5 V | 225 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CQCC-N52 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 52 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC52,.75SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.2098 mm | 19.05 mm | 19.05 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | LCC-52 | 52 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | |
| Yes | Yes | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T48 | Not Qualified | e3 | 70 °C | 48 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 61.849 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, | 48 | compliant | EAR99 | 8542.32.00.41 | ||||||||
| No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | COMMON | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 225 µA | CMOS | MILITARY | R-XDIP-T48 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 48 | CERAMIC | SDIP | SDIP48,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.78 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | unknown | 3A001.A.2.C | 8542.32.00.41 | ||||||||||||||
| No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | COMMON | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 180 µA | CMOS | COMMERCIAL | R-XDIP-T48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC | SDIP | SDIP48,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.78 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | unknown | EAR99 | 8542.32.00.41 | ||||||||||||||||
| Yes | Yes | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CDIP-T48 | Not Qualified | e3 | 70 °C | 48 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 60.96 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, | 48 | compliant | EAR99 | 8542.32.00.41 | ||||||||
| No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 180 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQCC-N52 | Not Qualified | e0 | 70 °C | 52 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC52,.75SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.2098 mm | 19.05 mm | 19.05 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | LCC-52 | 52 | not_compliant | EAR99 | 8542.32.00.41 |
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IDT7130SA70F
Integrated Device Technology Inc
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Check for Price Buy | No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 180 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQFP-F48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC, METAL-SEALED COFIRED | QFF | QFL48,.75SQ | SQUARE | FLATPACK | YES | TIN LEAD | FLAT | 1.27 mm | QUAD | 2.7432 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | QFF, QFL48,.75SQ | 48 | not_compliant | EAR99 | 8542.32.00.41 | ||||||
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IDT7130SA70C
Integrated Device Technology Inc
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Check for Price Buy | No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 180 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CDIP-T48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 60.96 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, DIP48,.6 | 48 | not_compliant | EAR99 | 8542.32.00.41 | ||||
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IDT7130SA70CB
Integrated Device Technology Inc
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Check for Price Buy | No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 30 mA | 4.5 V | 225 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T48 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 48 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 60.96 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-48 | 48 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | ||
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IDT7130SA70XC
Integrated Device Technology Inc
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Check for Price Buy | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | COMMON | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 180 µA | CMOS | COMMERCIAL | R-XDIP-T48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC | SDIP | SDIP48,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.78 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.41 | |||||||||||||||||
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IDT7130SA70L52B
Integrated Device Technology Inc
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Check for Price Buy | No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 30 mA | 4.5 V | 225 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CQCC-N52 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 52 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC52,.75SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.2098 mm | 19.05 mm | 19.05 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | LCC-52 | 52 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | ||
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IDT7130SA70PG
Integrated Device Technology Inc
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Check for Price Buy | Yes | Yes | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T48 | Not Qualified | e3 | 70 °C | 48 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 61.849 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, | 48 | compliant | EAR99 | 8542.32.00.41 | |||||||||
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7130SA70XCB
Integrated Device Technology Inc
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Check for Price Buy | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | COMMON | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 225 µA | CMOS | MILITARY | R-XDIP-T48 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 48 | CERAMIC | SDIP | SDIP48,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.78 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | unknown | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||||
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7130SA70XC
Integrated Device Technology Inc
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Check for Price Buy | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | COMMON | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 180 µA | CMOS | COMMERCIAL | R-XDIP-T48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC | SDIP | SDIP48,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.78 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | unknown | EAR99 | 8542.32.00.41 | |||||||||||||||||
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IDT7130SA70CG
Integrated Device Technology Inc
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Check for Price Buy | Yes | Yes | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CDIP-T48 | Not Qualified | e3 | 70 °C | 48 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 60.96 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, | 48 | compliant | EAR99 | 8542.32.00.41 | |||||||||
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IDT7130SA70L52
Integrated Device Technology Inc
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Check for Price Buy | No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 180 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQCC-N52 | Not Qualified | e0 | 70 °C | 52 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC52,.75SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.2098 mm | 19.05 mm | 19.05 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | LCC-52 | 52 | not_compliant | EAR99 | 8542.32.00.41 |