Findchips: Parametric Search Results for 70t3519s133bf8


Select Parts		Part Number

		70T3519S133BF8 Integrated Device Technology Inc
		IDT70T3519S133BF8 Integrated Device Technology Inc
		70T3519S133BF8 Renesas Electronics Corporation

				Most Relevant						Technical																	Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Transferred

9.4372 Mbit

256KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

15 mA

2.4 V

370 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208

208

BF208

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

9.4372 Mbit

256KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

15 mA

2.4 V

370 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

9.4372 Mbit

256KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

15 mA

2.4 V

370 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

15 mm

RENESAS ELECTRONICS CORP

CABGA

208

BF208

not_compliant

NLR

8542320041

Renesas Electronics

Compare

70T3519S133BF8

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

256KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

15 mA

2.4 V

370 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208

208

BF208

not_compliant

3A991.B.2.A

8542.32.00.41

IDT70T3519S133BF8

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

256KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

15 mA

2.4 V

370 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

not_compliant

3A991.B.2.A

8542.32.00.41

70T3519S133BF8

Renesas Electronics Corporation

Check for Price

Obsolete

9.4372 Mbit

256KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

15 mA

2.4 V

370 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

15 mm

RENESAS ELECTRONICS CORP

CABGA

208

BF208

not_compliant

NLR

8542320041

Renesas Electronics

Parametric results for: 70t3519s133bf8 under SRAMs