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Parametric » Memory » SRAMs

Parametric results for: 70t3509m under SRAMs

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Manufacturer Part Number: 70t3509m
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IDT70T3509M133BPGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 37.7487 Mbit 36 1MX36 4.2 ns 133 MHz MULTI-PORT SRAM COMMON 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA256,16X16,40 compliant 3A991.B.2.A 8542.32.00.41
70T3509MS133BPI
 Renesas Electronics Corporation 		Check for Price No No Obsolete 37.7487 Mbit 36 1MX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 255 20 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 17 mm 17 mm 17 mm RENESAS ELECTRONICS CORP not_compliant NLR 8542320041 CABGA 256 BP256 Renesas Electronics
70T3509MS133BPGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 37.7487 Mbit 36 1MX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC GREEN, BGA-256 compliant 3A991.B.2.A 8542.32.00.41 CABGA 256 BPG256
70T3509M133BPGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 37.7487 Mbit 36 1MX36 4.2 ns 133 MHz MULTI-PORT SRAM COMMON 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA256,16X16,40 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3509M133BPI
 Integrated Device Technology Inc 		Check for Price No No Transferred 37.7487 Mbit 36 1MX36 4.2 ns 133 MHz MULTI-PORT SRAM COMMON 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 85 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA256,16X16,40 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3509MS133BPI
 Renesas Electronics Corporation 		Check for Price No Obsolete 37.7487 Mbit 36 1MX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 85 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 17 mm 17 mm 17 mm RENESAS ELECTRONICS CORP BGA-256 not_compliant
70T3509MS133BPGI
 Renesas Electronics Corporation 		Check for Price Yes Yes Active 37.7487 Mbit 36 1MX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 80 mA 2.4 V 1.37 mA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm RENESAS ELECTRONICS CORP compliant NLR 8542320041 CABGA 256 BPG256 Renesas Electronics
IDT70T3509MS133BPG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 37.7487 Mbit 36 1MX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.4 V 1.12 mA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC LBGA, BGA256,16X16,40 compliant 3A991.B.2.A 8542.32.00.41 BGA 256
IDT70T3509MS133BP
 Integrated Device Technology Inc 		Check for Price No No Transferred 37.7487 Mbit 36 1MX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.4 V 1.12 mA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 70 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 17 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA256,16X16,40 not_compliant 3A991.B.2.A 8542.32.00.41 BGA 256
70T3509MS133BPG
 Renesas Electronics Corporation 		Check for Price Yes Yes Active 37.7487 Mbit 36 1MX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.4 V 1.12 mA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm RENESAS ELECTRONICS CORP compliant NLR 8542320041 CABGA 256 BPG256 Renesas Electronics
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