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Manufacturer Part Number: 70t3319s200bc
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70T3319S200BC8
 Integrated Device Technology Inc 		$98.2548 No No Transferred 4.7186 Mbit 18 256KX18 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3319S200BC
 Integrated Device Technology Inc 		$118.9700 No No Transferred 4.7186 Mbit 18 256KX18 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3319S200BC
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 18 256KX18 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3319S200BC8
 Renesas Electronics Corporation 		Check for Price No No End Of Life 4.7186 Mbit 18 256KX18 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 BC256 not_compliant NLR 8542320041 Renesas Electronics
70T3319S200BCG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 2.5 V 3.4 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-CBGA-B256 Not Qualified e1 3 70 °C 260 30 256 CERAMIC, METAL-SEALED COFIRED LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
70T3319S200BCG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3319S200BCG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3319S200BC8
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 18 256KX18 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3319S200BC
 Renesas Electronics Corporation 		Check for Price No No End Of Life 4.7186 Mbit 18 256KX18 2.5 V 10 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 BC256 not_compliant NLR 8542320041 Renesas Electronics
IDT70T3319S200BCG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 2.5 V 3.4 ns 200 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 525 µA 2.6 V 2.4 V CMOS COMMERCIAL S-CBGA-B256 Not Qualified e1 3 70 °C 260 30 256 CERAMIC, METAL-SEALED COFIRED LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41