Findchips: Parametric Search Results for 70V7319S166BCGI


Select Parts		Part Number

		70V7319S166BCGI8 Integrated Device Technology Inc
		70V7319S166BCGI Integrated Device Technology Inc
		IDT70V7319S166BCGI8 Integrated Device Technology Inc
		IDT70V7319S166BCGI Integrated Device Technology Inc

				Most Relevant						Technical																	Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count	Manufacturer Package Code

Check for Price

Transferred

4.7186 Mbit

256KX18

3.3 V

12 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

85 °C

-40 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

LBGA,

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Obsolete

4.7186 Mbit

256KX18

3.3 V

12 ns

166 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 µA

3.15 V

830 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA-256

compliant

3A991.B.2.A

8542.32.00.41

CABGA

256

BCG256

Check for Price

Yes

Transferred

4.7186 Mbit

256KX18

3.3 V

12 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

LBGA,

compliant

3A991.B.2.A

8542.32.00.41

BGA

256

Check for Price

Yes

Obsolete

4.7186 Mbit

256KX18

3.3 V

12 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

260

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA-256

compliant

3A991.B.2.A

8542.32.00.41

BGA

256

Compare

70V7319S166BCGI8

Integrated Device Technology Inc

Check for Price

Transferred

4.7186 Mbit

256KX18

3.3 V

12 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

85 °C

-40 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

LBGA,

compliant

3A991.B.2.A

8542.32.00.41

70V7319S166BCGI

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

4.7186 Mbit

256KX18

3.3 V

12 ns

166 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 µA

3.15 V

830 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA-256

compliant

3A991.B.2.A

8542.32.00.41

CABGA

256

BCG256

IDT70V7319S166BCGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

256KX18

3.3 V

12 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

LBGA,

compliant

3A991.B.2.A

8542.32.00.41

BGA

256

IDT70V7319S166BCGI

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

4.7186 Mbit

256KX18

3.3 V

12 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

260

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA-256

compliant

3A991.B.2.A

8542.32.00.41

BGA

256

Parametric results for: 70V7319S166BCGI under SRAMs