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70V631S10BFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 500 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | FPBGA-208 | 208 | BFG208 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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IDT70V631S10BFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 500 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | TFBGA, BGA208,17X17,32 | 208 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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70V631S10BFG8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | DUAL-PORT SRAM | COMMON | 1 | 2 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 500 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | RENESAS ELECTRONICS CORP | CABGA | 208 | BFG208 | compliant | NLR | 8542320041 | Renesas Electronics |