Findchips: Parametric Search Results for 70V3579S5BFGI


Select Parts		Part Number

		IDT70V3579S5BFGI Integrated Device Technology Inc
		IDT70V3579S5BFGI8 Integrated Device Technology Inc
		70V3579S5BFGI Integrated Device Technology Inc
		70V3579S5BFGI8 Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

1.1796 Mbit

32KX36

3.3 V

5 ns

100 MHz

MULTI-PORT SRAM

PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE

COMMON

32000

32.768 k

SYNCHRONOUS

3-STATE

PARALLEL

3.15 V

415 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B208

Not Qualified

85 °C

-40 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.7 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

1.1796 Mbit

32KX36

3.3 V

5 ns

100 MHz

MULTI-PORT SRAM

COMMON

32000

32.768 k

SYNCHRONOUS

3-STATE

PARALLEL

3.15 V

415 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B208

Not Qualified

85 °C

-40 °C

260

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

1.1796 Mbit

32KX36

3.3 V

5 ns

100 MHz

MULTI-PORT SRAM

PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE

COMMON

32000

32.768 k

SYNCHRONOUS

3-STATE

PARALLEL

3.15 V

415 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B208

Not Qualified

85 °C

-40 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.7 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

1.1796 Mbit

32KX36

3.3 V

5 ns

100 MHz

MULTI-PORT SRAM

PIPELINED ARCHITECTURE

COMMON

32000

32.768 k

SYNCHRONOUS

3-STATE

PARALLEL

3.15 V

415 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B208

Not Qualified

85 °C

-40 °C

260

208

PLASTIC/EPOXY

BGA

BGA208,17X17,32

SQUARE

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

INTEGRATED DEVICE TECHNOLOGY INC

BGA, BGA208,17X17,32

compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT70V3579S5BFGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

1.1796 Mbit

32KX36

3.3 V

5 ns

100 MHz

MULTI-PORT SRAM

PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE

COMMON

32000

32.768 k

SYNCHRONOUS

3-STATE

PARALLEL

3.15 V

415 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B208

Not Qualified

85 °C

-40 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.7 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

IDT70V3579S5BFGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

1.1796 Mbit

32KX36

3.3 V

5 ns

100 MHz

MULTI-PORT SRAM

COMMON

32000

32.768 k

SYNCHRONOUS

3-STATE

PARALLEL

3.15 V

415 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B208

Not Qualified

85 °C

-40 °C

260

208

PLASTIC/EPOXY

TFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

70V3579S5BFGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

1.1796 Mbit

32KX36

3.3 V

5 ns

100 MHz

MULTI-PORT SRAM

PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE

COMMON

32000

32.768 k

SYNCHRONOUS

3-STATE

PARALLEL

3.15 V

415 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B208

Not Qualified

85 °C

-40 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.7 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

70V3579S5BFGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

1.1796 Mbit

32KX36

3.3 V

5 ns

100 MHz

MULTI-PORT SRAM

PIPELINED ARCHITECTURE

COMMON

32000

32.768 k

SYNCHRONOUS

3-STATE

PARALLEL

3.15 V

415 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B208

Not Qualified

85 °C

-40 °C

260

208

PLASTIC/EPOXY

BGA

BGA208,17X17,32

SQUARE

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

INTEGRATED DEVICE TECHNOLOGY INC

BGA, BGA208,17X17,32

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: 70V3579S5BFGI under SRAMs