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Manufacturer Part Number: 70v3569
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70V3569S5DRGI8
 Integrated Device Technology Inc 		Check for Price Transferred 589.824 kbit 36 16KX36 3.3 V 5 ns DUAL-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS INDUSTRIAL S-PQFP-G208 e3 85 °C -40 °C 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC FQFP, compliant 3A991.B.2.B 8542.32.00.41
70V3569S5BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 36 16KX36 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC FINE PITCH, BGA-208 not_compliant 3A991.B.2.B 8542.32.00.41 CABGA 208 BF208 1999-01-01
70V3569S4BC
 Renesas Electronics Corporation 		Check for Price No No Obsolete 589.824 kbit 36 16KX36 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 460 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM RENESAS ELECTRONICS CORP not_compliant NLR 8542320041 CABGA 256 BC256 Renesas Electronics
IDT70V3569S4BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 36 16KX36 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 460 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC TFBGA, BGA208,17X17,32 not_compliant 3A991.B.2.B 8542.32.00.41 BGA 208 1999-01-01
IDT70V3569S6BCI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 589.824 kbit 36 16KX36 3.3 V 6 ns 83 MHz MULTI-PORT SRAM COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC LBGA, BGA208,17X17,32 not_compliant 3A991.B.2.B 8542.32.00.41 BGA 256
70V3569S5BF
 Renesas Electronics Corporation 		Check for Price No No Obsolete 589.824 kbit 36 16KX36 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES TIN LEAD BALL 800 µm BOTTOM RENESAS ELECTRONICS CORP not_compliant NLR 8542320041 CABGA 208 BF208 Renesas Electronics
70V3569S6BCG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 36 16KX36 3.3 V 6 ns 83 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 310 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC LBGA, BGA256,16X16,40 compliant 3A991.B.2.B 8542.32.00.41 BGA 256
70V3569S6BFGI
 Integrated Device Technology Inc 		Check for Price Yes Transferred 589.824 kbit 36 16KX36 3.3 V 6 ns MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 208 PLASTIC/EPOXY TFBGA SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC TFBGA, compliant 3A991.B.2.B 8542.32.00.41
70V3569S5BC
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 36 16KX36 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC 17 X 17 MM, 1.40 MM, 1 MM PITCH, BGA-256 not_compliant 3A991.B.2.B 8542.32.00.41 CABGA 256 BC256 1999-01-01
70V3569S6DR
 Integrated Device Technology Inc 		Check for Price No No Obsolete 589.824 kbit 36 16KX36 3.3 V 6 ns 83 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 310 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PQFP-G208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY QFP QFP208,1.2SQ,20 SQUARE FLATPACK YES TIN LEAD GULL WING 500 µm QUAD INTEGRATED DEVICE TECHNOLOGY INC 28 X 28 MM, 3.50 MM, PLASTIC, QFP-208 compliant 3A991.B.2.B 8542.32.00.41 PQFP 208 DR208
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