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Manufacturer Part Number: 70v3319s133bc
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70V3319S133BCI
 Integrated Device Technology Inc 		$92.4276 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BCI
 Renesas Electronics Corporation 		$273.8114 No No Active 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz DUAL-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 BC256 not_compliant NLR 8542320041 Renesas Electronics
70V3319S133BCG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-CBGA-B256 Not Qualified e1 3 70 °C 260 30 256 CERAMIC, METAL-SEALED COFIRED LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70V3319S133BCG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-CBGA-B256 Not Qualified e1 3 70 °C 260 30 256 CERAMIC, METAL-SEALED COFIRED LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BC8
 Renesas Electronics Corporation 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz DUAL-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 BC256 not_compliant NLR 8542320041 Renesas Electronics
IDT70V3319S133BCI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BCG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz APPLICATION SPECIFIC SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA256,16X16,40 compliant 3A991.B.2.A 8542.32.00.41
IDT70V3319S133BCGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70V3319S133BCGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-CBGA-B256 Not Qualified e1 3 85 °C -40 °C 260 30 256 CERAMIC, METAL-SEALED COFIRED LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BC
 Renesas Electronics Corporation 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz DUAL-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 BC256 not_compliant NLR 8542320041 Renesas Electronics
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