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Manufacturer Part Number: 70v3319
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70V3319S133BCI
 Integrated Device Technology Inc 		$88.0493 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BC8
 Integrated Device Technology Inc 		$96.8688 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BF8
 Integrated Device Technology Inc 		$96.8688 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S166BF
 Integrated Device Technology Inc 		$97.9963 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 500 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S166BF8
 Integrated Device Technology Inc 		$101.6946 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 500 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S166BC8
 Integrated Device Technology Inc 		$101.6946 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 500 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S166BFG8
 Integrated Device Technology Inc 		$101.6946 Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 500 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA FBGA-208 208 BFG208 compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BFI8
 Integrated Device Technology Inc 		$106.5456 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BCI8
 Integrated Device Technology Inc 		$106.5456 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S166PRFG8
 Integrated Device Technology Inc 		$111.8754 Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 500 µA 3.45 V 3.15 V CMOS COMMERCIAL R-PQFP-G128 Not Qualified e3 3 70 °C 260 30 128 PLASTIC/EPOXY LFQFP QFP128,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP TQFP-128 128 PKG128 compliant 3A991.B.2.A 8542.32.00.41
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