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Parametric » Memory » SRAMs

Parametric results for: 70T3589S166BF under SRAMs

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Manufacturer Part Number: 70t3589s166bf
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70T3589S166BF
 Renesas Electronics Corporation 		Check for Price No No Obsolete 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 BF208 not_compliant NLR 8542320041 Renesas Electronics
70T3589S166BFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 2.5 V 3.6 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-CBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 CERAMIC, METAL-SEALED COFIRED LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 208 compliant 3A991.B.2.A 8542.32.00.41 LFBGA, BGA208,17X17,32
70T3589S166BFI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 36 64KX36 12 ns 166 MHz MULTI-PORT SRAM COMMON 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY FBGA BGA208,17X17,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 208 compliant 3A991.B.2.A 8542.32.00.41 LFBGA, BGA208,17X17,32
IDT70T3589S166BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 208 not_compliant 3A991.B.2.A 8542.32.00.41 TFBGA, BGA208,17X17,32
70T3589S166BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 208 compliant 3A991.B.2.A 8542.32.00.41 BGA, BGA208,17X17,32
70T3589S166BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208
70T3589S166BFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 12 ns 166 MHz MULTI-PORT SRAM COMMON 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY FBGA BGA208,17X17,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 12 ns 166 MHz MULTI-PORT SRAM COMMON 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY FBGA BGA208,17X17,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41
70T3589S166BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 2.5 V 3.6 ns 166 MHz APPLICATION SPECIFIC SRAM COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41 BGA, BGA208,17X17,32
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